BERLIN – The second incarnation of a panel level packaging consortium, PLC 2.0, investigated warpage and die shift in large format reconfigured panels (18" x 24"), and considerable progress has been made toward understanding the root causes. With these insights, the relevant parameters can now be controlled better to enable large-area fine-line RDL processes. The analytical effort has paid off, as RDL could be scaled down considerably on the panel level, making the most of the advantages of both wafer and panel-level technologies and paving the way for an entirely new process chain with new equipment and materials.

TABY, SWEDEN -- Mycronic has signed an agreement to acquire Shenzhen Huan Cheng Xin Precision Manufacture, an OEM of screen printers and pick-and-place machines.

LOGANSPORT, IN – Compal Electronics acquired Cal-Comp USA (Indiana) for an undisclosed sum, according to reports.

PALMDALE, CA – Lockheed Martin completed construction on a 215,000 sq. ft. Skunk Works headquarters and smart manufacturing facility here, according to reports.