WINSTON-SALEM, NC -- Dell this month will open a 750,000 sq.-ft. manufacturing facility -- the computer maker's largest -- in the Alliance Science & Technology Park in Winston-Salem.

The new facility will employ about 700 people in its first year of operation and will have 1,500 employees within five years, Dell said in a statement today.

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NY -- Jaco Electronics Inc., a distributor and integrator of electronic components and flat panel displays, today reported fiscal fourth-quarter revenues grew 3.5% compared to last year, but earnings dropped sharply due to a large inventory writedown.

For the quarter ended June 30, the company reported net sales of $59.1 million, up from $57.1 million. The net loss was $1.98 million, including a one-time, non-cash, pretax writedown of $2.2 million. Last year, the company reported income of $177,000.

For the year, net sales were $231.8 million, down from $249.1 million. The net loss increased to $4.9 million, from $556,000. Fiscal fourth quarter SG&A expenses declined 14% vs. a year ago. For the year, SG&A fell 8%.

In a statement, Jaco chairman and chief executive Joel Girsky said, “I believe we have made progress in extending our U.S. market presence with a focused marketing model emphasizing Jaco's core strengths in providing value-added products and services for our customers, especially in the flat panel display and Far Eastern logistics business segments.”

Jaco supports large contract manufacturers in Asia with logistics programs such as automated inventory management.

AUSTIN – Use of system in package is expected to grow 20% compounded annually through 2009, driven by wireless products, especially cellphones.

In a new report, System-in-Package: The New Wave in 3D Packaging, TechSearch International explores the technology advances and market drivers that have produced a renaissance in multichip packaging solutions.

How are SiPs different from multichip packages of the past? According to TechSearch one application – wireless products – stands out as a high-volume driver that did not exist a dozen years ago, when many multichip packages were first introduced.

According to TechSearch, SiP is a functional system or subsystem assembled into a single package containing two or more dissimilar die, typically combined with other components such as passives, filters, antennas, and/or mechanical parts. The components are mounted together on a substrate to create a custom, integrated product.

A variety of SiPs are found in the RF, digital baseband, and transceiver sections of mobile phones. The reason: SiPs deliver increased functionality and performance in small form factor for mobile communication, resulting in significantly greater adoption rates than any previous MCM. Emerging applications for mobile phones include mini hard disks and camera modules. Planar and stacked configurations are in use and several companies, including Philips, STMicroelectronics and SyChip, have introduced integrated passive substrate solutions.

SiP solutions are increasingly found in a broad range of additional market segments, including consumer electronics such as digital cameras and camcorders, automotive, military/aerospace, medical, computer, and telecom. SiP is forecast to hit a unit growth rate of almost 20% CAGR between 2004 and 2009, TechSearch says.

JACKSON, MI -- Sparton has passed on buying Celestica's PCB assembly plant in Iowa, saying that anticipated DoD work earmarked for the site has failed to materialize. The EMS provider said last spring it would try to buy the 70,000-sq. ft. Mount Pleasant plant and save the 340 jobs.

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