FRANKLIN, MA - SMT manufacturing experts from Speedline Technologies will address the issues involved in "Lead-Free Reflow Soldering Power And Nitrogen Consumption" during a free, live, Web seminar on May 19 from 11 a.m. to 12 noon, ET. 

Selecting a reflow oven for an SMT manufacturing process requires numerous engineering considerations, including board size capacity, heating zones, nitrogen compatibility and the ability to maintain even heat.  With the introduction of lead-free materials, new and more complicated factors are compounding the decision. 

With the introduction of lead-free requirements, process engineers must now also consider the ability to achieve the heat required to reflow the lead-free solder paste and to cool the soldered joints at a rate that will provide the best possible product quality. In a lead-free process, two "cost of ownership" issues now gain additional significance: energy consumption and nitrogen consumption. The seminar will discuss an analysis of energy and nitrogen consumption in lead-free reflow soldering equipment. 

Topics will include: a comparison of energy consumption in new reflow oven designs versus previous reflow oven designs; an actual power consumption case study of lead-free versus tin lead process; and methods for controlling nitrogen consumption.

For more information or to register, visit speedlinetech.com/seminars.

 

 

Zurich, Switzerland -- DEK has signed a supply and license agreement for its VectorGuard stencil technology with Gemido, a France-based designer and manufacturer of machines for the electronics industry. Gemido will manufacture the stencils from foil blanks supplied by DEK and will also provide customers with VectorGuard frames. 

Gemido will implement this agreement in France and the French part of Switzerland.

Tokyo -- The 35th International Electronic Circuits Expo will take place June 1-3 at the Tokyo Big Sight center. The show, sponsored by JPCA (Japan Printed Circuit Association) -- a member of the WECC (World Electronic Circuits Council) -- will focus on "The Challenge, Starting for the Next Evolution."

The show is offered in conjunction with the JIEP (Japan Institute of Electronics Packaging) 2005 Microelectronics Show: "Discover the Next Generation Technologies on Electronics Packaging."

The two shows will feature 530 exhibiting companies with 1,531 booths, and the producers expect more than 100,000 global attendees during the three-day period.

Participants can attend three keynote sessions: professor Dr. Kenichi Ohmae of UCLA will address "The Next Global Stage - Challenges and Opportunities in our Borderless World;" Dr. Takeo Nakagawa, CEO of Fine Tech Corp., will talk about strategies for the future of manufacturing in Japan; and Dr. Tsugio Makimto, Sony's corporate advisor will address the role of electronics packaging in the paradigm shift era of electronics industry.

The concurrent Jisso (Advanced Electronics Packaging) Technology Symposium will offer technological sessions such as SiP/Multi Chip Package, Thin Wafer/Chip Packaging, High Frequency Packaging/New Substrate Materials, FPC, MEMS, Embedded Packaging Board and Opto-electronics Packaging technologies on the topics.

Click here for early registration.

 

 

Edina, MN -- Two new software applications for materials and RoHs declaration are available from the Surface Mount Technology Association's Web site.
 
For small-to-medium size enterprises with RoHS-related obligations, the Material Declaration Wizard (MDW) is an automated substance-level data collection software. 
 
The Windows desktop application collects, aggregates and distributes substance data that allows you to declare substances required by RoHS, JIG A, B, & C, or to declare that your components have been lead-free assembly tested.

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