Circuits Assembly Online Magazine - Features

SHIRLEY, MA -- V.J. Electronix Inc. has recently moved its x-ray production department to Shirley, MA, to join with its rework group for a more efficient operation.

The x-ray group offers manual and automated inspection systems; the rework group manufactures semiautomated and automated rework systems for microBGA, CSP and flip-chip component technologies, including lead-free processing.

The facility is located at 1000 Mount Laurel Circle, Shirley, MA 01464; (978) 425-9446.

PHOENIX -- FlipChip International and Kester will collaborate on SE-CURE 7501 low-void wafer bumping paste. Kester, a supplier of solder and related materials and services, has worked with FCI to introduce the solder paste formula designed for wafer bumping. Under the agreement, Kester will manufacture and sell the paste globally.

The paste reportedly features a stable performance down to 70 µm bump heights (corresponding to 135 µm bump pitches) for a consistent printing process. The stable printing provides consistency of bump height across the wafer as well as from wafer to wafer.

STAMFORD, CT- Feinfocus has opened a new office in Shanghai to sell its x-ray systems.

Located in the Zhangjiang Semiconductor Industry Park in Pudong, Feinfocus Asia/Pacific will provide sales and technical support to the growing Asian customer base.

It will operate as part of the newly-expanded COMET China office.

Friedhelm Maur, regional sales manager, and Zoran Zecevic, service engineer, have relocated to Shanghai from the global headquarters in Garbsen, Germany.

SEMI (semi.org) is organizing an export control seminar to take place in conjunction with SEMICON China on March 16 in Shanghai.

Speakers from government and industry will discuss export control requirements related to China and explore what exporters and Chinese customers need to do to meet these requirements and ensure export compliance.

For more information, contact Maggie Hershey: mhershey@semi.org.

SAN JOSE -- How will the far-reaching European Union's WEEE and RoHS Directive affect the semiconductor equipment industry? A new white paper by the International Compliance and Regulatory Committee tackles that question.

The paper is available from SEMI. Go to www.semi.org/ehs and click on "European Union's WEEE and RoHS Directives."

DANBURY, CT -- BPA Consulting Ltd. and Quantum Performance Group LLC will present executive briefings on next generation interconnect technology for high speed and miniaturized systems. The briefings will take place in Newport Beach and San Jose, and Boxborough, MA, the week of April 18.

Topics will include:

Next-generation systems: The demand and driving forces for innovative interconnects.
Worldwide high-speed interconnect technology, market trends, manufacturing challenges and opportunities.
Flexible and rigid-flexible circuits manufacturing, materials and trends.
The future structure and strategic implications for participants in the interconnect supply industries.
Asia - opportunity, threat or both?

Meetings are limited to 25 delegates to ensure a workshop-style environment. Presenters include: Mike Campbell, Dan Feinberg, Dr. Jim Hickman, Mark Hutton, Nicholas Pearne, Francesca Stern and Gene Weiner.

For further information contact Campbell at m.campbell@bpaconsulting.com or nextgenbriefing@quantumpg.com.