Aegis Industrial Software Corp. (Philadelphia, PA), a supplier of manufacturing productivity systems for electronics assemblers, recently announced that Accutron Inc. (Windsor, CT), a contract electronics manufacturer, has implemented Aegis' new product introduction (NPI) and manufacturing execution system (MES) software. Accutron uses the software to expedite the introduction of new products, deliver paperless instructions to the floor and manage the quality and traceability of its automotive, medical and telecom assemblies.
"Aegis software complements our manufacturing process with a dynamic approach," commented Vijay Faldu, president of Accutron. "Their platform is extremely user friendly and very effective in product tracking throughout our facility. This software has allowed us to achieve an even higher level of process control, which ultimately translates into increased customer satisfaction."
Wanting a single solution spanning the factory office and factory floor, Accutron deployed CircuitCAM, CheckPoint, FUSION iServer, iView, iTrac and iQ to meet the needs of their manufacturing process. These solutions drive computer-aided design (CAD) and bill of materials process, revision management, document delivery to the factory and product tracking and quality analysis in real-time.
KIC (San Diego, CA), a thermal process development and control software provider, has announced that its national sales manager, Marybeth Allen, will speak on the thermal process of low temperature co-fired ceramic (LTCC) at the IMAPS Orange Chapter Dinner Meeting on Feb. 19, 2004.
The speech, "Hot Product In Control — LTCC's Thermal Process," will describe applications for the use of LTCC and explain how these applications are multiplying rapidly. Standard components and other modules for communications, biomedical and automotive are being manufactured in high volume. Most of the world's production is currently done in box furnaces, which could be a lengthy process, adding cost and limiting production throughput. An alternative is the production of these parts in conveyorized furnaces. Allen's speech will discuss the advantages and challenges of moving to a conveyorized firing process. It will also include furnace setup, optimization relative to tight process windows and continuous monitoring of the thermal process to eliminate defects.
Allen's expertise lies within the management of the thermal process. She has 20 years of experience in the electronics assembly industry covering surface mount, thick film and packaging. As Project Manager, she works with manufacturers of equipment and materials for board and package assembly for thermal processes. Additionally, she is a past chapter president of SMTA & IMAPS and has authored various industry papers.
For more information on the meeting, visit www.imaps.org/chapters/orange.htm.
Copyright 2004, UP Media Group. All rights reserved.
SofTech Inc. (Tewksbury, MA), a provider of design-through-manufacturing productivity solutions, and Cimmetry Systems (Cambrige, MA), a provider of visualization and collaboration solutions for the A/E/C, Engineering, Manufacturing and Electronics markets, have announced a partnership. SofTech will license Cimmetry's AutoVue visualization and collaboration technology for its ProductCenter product lifecycle management (PLM) solution.
Integration of the visualization technology will extend the collaboration capabilities of the PLM, enhancing the solution's document management, design integration, configuration control, change management and enterprise integration capabilities for optimizing product development. The PLM users will gain capabilities to view, markup and collaborate in real-time on native product data of virtually any type, including: 3-D CAD parts and assemblies, 2-D CAD drawings, EDA PCB/IC layouts and schematics, scanned and raster documents, vector files, office documents and graphics.
AutoVue allows users to view, markup and collaborate in real time on over 200 native formats including: CATIA, Pro/Engineer, Unigraphics, SolidWorks, Inventor, Solid Edge, JT, AutoCAD, MicroStation, Mechanical Desktop, Cadence Allegro, Mentor Board Station, Orcad, PADS, Microsoft Office, Visio, PDF and TIFF. It is available as a Windows desktop application or a thin-client server based solution.
Copyright 2004, UP Media Group. All rights reserved.
Universal Instruments Corp. (UIC, Binghamton, NY) announced recently that it has established requisites for a long-term partnership with Shanghai, China-based DaimlerChryslerSIM Technology (DCSIM Tech.). DCSIM Tech. is a joint venture between DaimlerChrysler and Shanghai Institute of Microsystem and Information Technology.
According to UIC, the objective is to build local expertise in advanced electronics packaging. The two companies will invest in China's future in these technologies by training engineers, working with local suppliers, increasing local infrastructure and supporting local company projects for first- and second-level packaging.
"Our vision is to build an industry capable of servicing local Chinese component manufacturers and assemblers as well as export markets throughout Asia and worldwide," said Richard Boulanger of UIC's SMT Laboratory. "Both businesses will invest substantial resources to nurture local technical expertise and enhance the local infrastructure in Shanghai and Suzhou."
"Both companies are well positioned to develop China's high-tech electronics industry," stated Dr. Xiaoming Xie of DCSIM Tech. "As one of the major players on the local market for many years, I am pleased that this agreement has established long term objectives, as a high level of ongoing commitment is the only truly effective way to establish China as a global center of excellence."
Under the draft terms, UIC—with laboratories in Binghamton and Suzhou, China—will also help sponsor a student from DCSIM Tech. to join the electronics packaging program at Binghamton University. DCSIM Tech. will offer students and other resources such as failure analysis and reliability testing for specific Universal projects.
FocalSpot, Inc. (San Diego, CA), a provider of inspection and rework/repair solutions and services, recently announced that contract manufacturer Vanguard EMS (Portland, OR) has selected Den-on Instruments, RD-500 for advanced rework applications, including rework of lead-free assemblies.
Designed for both lead-free and standard solder, the system is a vision-based, semi-automated reflow, removal and placement rework station for printed circuit assemblies, surface-mount devices (SMDs) and connectors. The system combines high-powered top and bottom heater configuration with auto-profiling technology to efficiently heat and reflow rework applications—from small personal digital assistants (PDAs) and cell phones to personal computer (PC) motherboards and multi-layered avionics back planes.
Vanguard selected the system based on its efficient heating technology, ease-of-use and price performance. FocalSpot's product manager, Raymond LaFleur, was tasked during the evaluation to demonstrate the performance of the machine on several demanding applications, including lead-free rework.
UP Media Group Inc. (Atlanta, GA) has announced a call for abstracts for PCB Design Conference East 2004 (PCB East), which will be held Oct. 4-8, 2004, at the Holiday Inn in Manchester, NH. Sponsored by industry trade magazines Printed Circuit Design & Manufacture and Circuits Assembly, PCB East annually provides attendees and vendors with an East Coast conference and exhibition for engineering, design and manufacture professionals.
The five-day conference is made up of a three-day Technical Conference that features short courses and papers, and two days of Professional Development one-day and two-day courses.
Papers and presentations are being sought for the Technical Conference, based on the following course durations: 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops or panel sessions, and half-day (3.5 hour) seminars. Papers and presentations also are sought for a Professional Development Curriculum of one-day and two-day tutorials.
Papers and presentations are sought for, but not limited to, the following topics:
- High speed, high frequency and signal integrity
- Impedance and crosstalk control
- EMI/EMC analysis
- Thermal analysis
- RF and microwave
- Packaging and components
- Area arrays
- FPGA design and implementation
- Embedded passives and active devices
- Flexible circuitry
- HDI design and technologies
- PCB design/layout techniques
- Component library creation and management
- Design for manufacture, test and assembly
- Design (including analog, digital and power supplies)
- PCB fabrication
- Soldering (especially lead-free and its impact on design)
- Surface finishes
- Industry forecasts
- Business and design/supply chain issues
To be considered as a speaker or presenter for PCB East, fill out the online submission form or send an email to Conference Chair Andy Shaughnessy, ashaughnessy@upmediagroup.com, by April 5, 2004. Your e-mail should include: a suggested course title, a suggested course length, a short description of your target audience, a 100- to 300-word abstract and a short speaker bio.
Each speaker/presenter will receive a copy of the Technical Conference Proceedings CD-ROM, a free pass for the three-day Technical Conference and free admission to the two-day exhibition, keynote address and other special events.
For more information or to submit a paper and/or presentation online, visit www.pcbeast.com.
UP Media Group (UPMG) specializes in magazine publishing and trade show and conference production. UPMG currently publishes Printed Circuit Design & Manufacture and Circuits Assembly. In addition, UPMG produces two annual conferences and trade shows for the design and manufacture industry—PCB Design Conference West in the San Jose, CA area, and PCB Design Conference East in the Boston area. UPMG also hosts the PCB Road Series of technical seminars in cities throughout the U.S.
Copyright 2004, UP Media Group. All rights reserved.
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