HAVERHILL, MA – Circuit Technology Center has added several new procedures covering ball grid array component reballing and inspection to its online guidebook.
NANNING, CHINA – United Time Technology (UTime) and the People's Government of Jiangnan District in Nanning City signed an investment agreement for UTime to establish 20,000 sq. m. manufacturing facilities for a line of smart telecom devices here.
SANTA CLARA, CA – The Printed Circuit Engineering Association today announced it has signed a letter of intent to acquire certain assets of UP Media Group Inc., including its signature publications and industry-leading trade shows. The deal establishes PCEA as the leading association for printed circuit engineers worldwide, with over 2.5 million engagements annually to printed circuit engineers, designers, fabricators and assemblers.
WASHINGTON – The US Department of Commerce is establishing an early alert system to detect supply chain shortages in the semiconductor industry, according to reports.
CAMBRIDGE, UK – The high-temperature and time-consuming reflow process leaves space for electrically conductive adhesives, according to a new IDTechEx report. ECAs comprise a metal powder embedded within a polymer resin and are well suited to applications that require electronic components to be mounted on anything other than a conventional FR4 substrate, especially when the substrate material is thermally fragile.
Press Releases
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
- TTCI Expands Southeastern U.S. Presence Through Partnership with Microwave Component Sources; Bert Horner and Ryan Peavey Comment
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