AUSTIN, TX – Power devices are experiencing growth, with overall lead-frame package shipments expected to increase 4.3% from 2017 to 2021, with stronger growth projected for Cu clip packages, according to TechSearch International.
MOUNT PLEASANT, WI – The first round of Foxconn’s Smart Cities, Smart Futures competition prompted 325 entries from students, faculty and staff at higher education institutions in Wisconsin.
NEWARK, NY – IEC Electronics reported revenues of $34.2 million for the fiscal fourth quarter of 2018, up 24% year-over-year and 15% sequentially.
CHELMSFORD, MA – Ametek has acquired Spectro Scientific for approximately $190 million.
BATANGAS, PHILIPPINES -- Construction has begun on a massive new EMS plant for Cal-Comp Electronics's local subsidiary.
NEW YORK – The global printed circuit board market was valued at $63.1 billion in 2017 and is expected to reach $76.9 billion by 2024, a CAGR of 3.1%, says Energias Market Research.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager