TAIPEI -- After months of speculation and at least one unraveled deal, Foxconn will acquire a 66% share of Sharp for 389 billion yen ($3.4 billion), the companies said today.
LAS VEGAS -- Work on the latest revision to the industry standard for soldered electrical and electronic assemblies has begun, with the task group focused on vertical solder fill for Class 2 product and BGA voiding, among other topics.
HANOI -- Samsung Electronics will invest $300 million in a new research and development project here in exchange for free rent.
TAIPEI -- Foxconn will hold a scheduled board meeting this week as its deal to acquire Sharp continues to twist and turn in the financial wind.
ELK GROVE, CA -- A California-based EMS company is planning a second facility here, enticed by local incentives and industry trends toward onshoring.
BANNOCKBURN, IL – IPC presented IPC Rising Star Awards at Apex Expo to Steven Bowles, L-3 Fuzing and Ordnance Systems; Stan Rak, Continental Automotive; Matt Turpin, Zentech Manufacturing; and Peter Zhou, Huawei Technologies.
Press Releases
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- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Long Island Expo & Tech Forum
- BTU International Announces Strategic Partnership with Repstronics to Enhance Presence in Mexico and Central America
- High-Performance TIMs: Beyond Traditional TIM Materials