ARLINGTON, VA – JEDEC Solid State Technology Association published a revised standard that establishes requirements for the next generation of semiconductor device package components: JESD30G.
LITTLETON, MA – VJ Electronix and Apollo Seiko together have developed printed circuit board preheat to enhance the performance of robotic soldering.
BILLINGSTAD, NORWAY – Kitron reported fourth quarter revenue of NOK 525 million ($61.3 million), an increase of 10.3% year-over-year.
TABY, SWEDEN – Mycronic has acquired 75% of RoyoTech Digitalelektronik and has an option to acquire the remaining 25%. At the same time Mycronic has acquired 100% of Kognitec Vertrieb and Service. Both companies are based in Höhenkirchen, Germany.
INDIANAPOLIS – ACE Component Services Group and Divisys International will co-host a solderability testing and component lead tinning workshop here Mar. 8.
MINNEAPOLIS -- SMTA announced the finalized program and registration is open for the South East Asia Technical Conference on Electronics Assembly in April in Penang.
Press Releases
- Governor Glenn Youngkin Announces First-of-its-Kind American Tin Production Facility
- Surf-Tech Manufacturing Unveils 4,000 sq-ft Expansion, Growing Operations by 50%
- Cetec ERP Expands into Europe with New Strategic Partner
- Vexos Appoints New SVP of Operational Excellence; and Expands Juarez Manufacturing Capacity