DORNSTADT, GERMANY – The 8th ASYS Group Technology Days brought some 400 customers and partner companies together to observe a full working SMT line and listen to several live electronics assembly seminars.
AYLESBURY, UK – Nordson Dage has developed a new test method for the evaluation of die strength by means of cantilever bending, where three-point bending is not suitable for die with a thickness of fewer than 50µm.
EARTH CITY, MO -- Raven Industries will close its facility here by next fall and lay off 58 workers.
FRANKLIN, MA – Pat O’Brien will take over as vice president and general manager of Speedline Technologies on Jan. 1. O’Brien is currently vice president and general manager of ITW Thermal Processing.
SAN JOSE — Worldwide semiconductor manufacturing equipment orders rose 4% year-over-year to $9.32 billion in the third quarter, SEMI said.
FRAMINGHAM, MA -- Looming software advacements underpin IDC's annual list of worldwide manufacturing predictions, released late last week.