ATLANTA – ECIA members face a broad spectrum of cyber risks that could potentially impact their business operations. These risks can be more complex and challenging due to their international scope. In response to these concerns, ECIA’s Global Industry Practices Committee (GIPC) has published a guidance document, prepared as the result of a cooperative effort between electronic component manufacturers and their authorized distributors.
PEACHTREE CITY, GA – Experts in printed circuit design and manufacturing will be on hand at PCB West 2023 to answer attendee questions during the exhibition on September 20, the Printed Circuit Engineering Association announced today.
BRONSCHHOFEN, SWITZERLAND – Cicor Group announced 26.2% year-on-year sales growth for the first half of the year, reaching CHF199.2 million ($230.4 million) compared to CHF157.7 million (182.4 million) in the first half of last year.
MILPITAS, CA – Worldwide silicon wafer shipments increased 2% quarter-over-quarter to 3,331 million square inches in the second quarter of 2023, down 10.1% from the 3,704 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
WASHINGTON – The United States faces a significant shortage of technicians, computer scientists and engineers, with a projected shortfall of 67,000 of these workers in the semiconductor industry by 2030 and a gap of 1.4 million such workers throughout the broader US economy, according to a study released by the Semiconductor Industry Association in partnership with Oxford Economics.
WESTWOOD, MA – Chase Corporation, a manufacturer of industrial coatings and tapes, has entered into a definitive agreement to be acquired by an affiliate of investment funds managed by investment firm KKR for an all-cash transaction of around $1.3 billion.