AUSTIN – Flip chip in package is expanding in mobile computing, especially smartphones and tablets. In units, the compound annual growth rate from 2011 to 2016 is almost 26%, says TechSearch International.
BANNOCKBURN, IL – January North American printed circuit board shipments were down 1.1% year-over-year, and orders decreased 4% compared to January 2012, says IPC.
SAN JOSE -- Fab equipment spending for Front End facilities is expected to hover around flat in 2013 and with an increase of 24% in 2014.
MANASSAS, VA – Zestron and Speedline are presenting a free 45-minute webinar as part of a series: Inline Cleaning Equipment & Process Optimization.
LOS ANGELES – Ducommun today reported fourth-quarter 2012 net sales of $193.9 million, up 3% year-over-year.
SAN DIEGO – In recognition of their contributions to IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC Apex Expo.
Press Releases
- Altus and Koh Young to Host Webinar Showcasing AI Applications in Inspection Software
- Instrumental Announces New Investment to Accelerate Server and Rack Manufacturing for Data Centers
- Milwaukee Electronics’ U.S. Facilities Now AS9100 Certified
- AIM Solder Promotes Timothy O’Neill to Vice President of Technology