SAN JOSE, CA – Sanmina-SCI reported revenue of $1.58 billion for the fiscal fourth quarter ended Sept. 29, down 7.1% year-over-year and up 1.9% sequentially. GAAP net income was $164.2 million, up 807% year-over-year.
LYON, FRANCE – Demand for so-called "mid-end" tools and related materials for wafer-level packaging is surging, thanks to the growth of 3D IC and wafer-level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer bumping.
ORLANDO – The DMSMS & Standardization Conference will take place here Nov. 26-29. It will include panels, briefings and training on the counterfeiting issue.
MINNEAPOLIS, MN – The Surface Mount Technology Association said its membership recently elected Bill Barthel as president.
MANCHESTER, NH – EPTAC Corp. has appointed Brenda Clunie as vice president and operations director.
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