Circuits Assembly Online Magazine - Features

BANGKOK -- Fabrinet chief financial officer Mark Schwartz has informed the EMS company's board of his intention to resign, effective March 1.

BANGKOK -- Fabrinet reported its first-ever quarterly loss, as the Bangkok area floods closed two of the company's largest plants for several weeks last fall.

FRAMINGHAM, MA – The worldwide mobile phone market grew 6.1% year-over-year in the fourth quarter as the feature phone market declined faster than anticipated, dragging market growth down to its lowest point in over two years.

FRAMINGHAM, MA – The worldwide smartphone market grew 54.7% year over year in the fourth quarter as Apple unleashed its iPhone 4S on an eager marketplace.

EL SEGUNDO, CA -- Global electronics manufacturing services revenue will be flat in 2012, the result of lingering economic concerns in Europe and the US, IHS iSuppli says.

BANNOCKBURN, IL – The latest moisture-sensitive device standard now covers handling, packing and shipping of non-IC electronic components.

J-STD-033C, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components, provides guidance for certain electronic components that to date had not been covered. Those include parts classified per J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

The C revision also contains a correction made to the desiccant calculation and an allowance for less use of desiccant for MSL2 parts, if desired. J-STD-033C also includes diagrams of recommended, not recommended and acceptable MBB air evacuation.

The new standard was developed by IPC and JEDEC. It provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow-sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.