FARGO, ND -- North Dakota State University researchers have developed a noncontact wafer-to-product electronics manufacturing technology said to reduce unit cost and size of electronics end-products.

TOKYO – Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, dropping for the third consecutive month, says the Semiconductor Equipment Association of Japan.

Japan-based manufacturers of semiconductor equipment received $1.04 billion in orders during the month, down 4.5% sequentially. Orders fell 37.9% compared to September 2010.

Billings for September were $1.4 billion, down 3.2% sequentially and down 5% year-over-year, says the association.

MUNICH – A workshop on Advanced Packaging Trends for Medical Electronics will be held here Nov. 14, one day prior to Productronica. The workshop will be hosted by Fraunhofer EMFT and TechSearch International.

The workshop will provide a forum on all aspects of medical electronics packaging and assembly, including technology, infrastructure and economics.

For more information, visit www.techsearchinc.com.

TORONTO -- Celestica reported third-quarter profits rose 35% year-over-year, but the world's fourth largest contract assembler said visibility in the current quarter is waning.