WATERTOWN, SD – OEM Worldwide today announced a four-year $11 million expansion that could add up to 150 new jobs.

The electronics contract manufacturer has completed its first phase, a 50,000 sq. ft. expansion to its facility here. Future plans include upgrading and replacing the company’s automated printed circuit board assembly equipment.

OEM specializes in high-mix, low-to-medium volume PCB assemblies and higher-level assembly for precision products in medical, communications and industrial applications.

The firm anticipates expanding into military/aerospace and smart grid markets, and will add 150 new jobs.

BANNOCKBURN, IL – After a big 2010, printed circuit board production in the Americas is expected to grow 2.5% in 2011, IPC said.

IPC based its forecast on a sample of 40 North American PCB manufacturers with an aggregate $2.3 billion in total sales, accounting for approximately 55% of the North American market.

Last year, North American rigid PCB sales rose 18%, while flexible PCB sales grew 16%. Production increased 6.9% in North America.

NEW YORK – A new study of nearly 1,200 high-tech companies sheds new light on the likely rationale for big, recently announced deals, including Google’s bid to acquire Motorola Mobility Holdings, AT&T’s offer to acquire T-Mobile USA, and Hewlett-Packard’s potential divestiture of its PC business.

Canton, SD – Contract manufacturer Legacy Electronics has begun production at its 40,000 sq. ft. manufacturing plant here.

In June the firm completed Phase 1 of the move from San Clemente, CA, including installation, calibration, and qualification of the Canton electronics component production line.

The firm has openings for manufacturing and test technicians, quality inspectors and rework technicians. Local applicants can send resumes and cover letters to applyinsouthdakota@legacyelectronics.com.

Founded in 1993, Legacy Electronics holds several patents and trademarks, including those for its Canopy chip-stacking process technology, and its Multiple Device Canopy (MDC) for embedded computing and high-density VLP modules.