caLogo

OSAKA, JAPAN -- SIIX Corp. and Ayrshire Electronics have entered a business alliance whereby the two contract assemblers will share technical and physical resources to their respective worldwide customer base.

Read more ...

TAIPEI Hon Hai (Foxconn) reported third-quarter net income of $641 million, down 8.6% year-over-year, on lower demand for PCs and consumer goods. It was the fourth consecutive quarter that profits fell.

Unconsolidated sales were roughly flat at $22.2 billion.

Nine-month net income fell 16% to $1.56 billion on unconsolidated sales of $61.8 billion.

The company’s slow economic recovery is attributed to slowing demand for computers and game machines, say published reports. Global computer shipments went up 3.2% in the third quarter from a year earlier, missing the 5.1% growth estimate, according to Gartner.

This quarter’s profits could rise, however, because of Apple’s iPhone 4S and dropping costs to move factories.

Hon Hai is in the process of moving factories to inland China and expanding in Brazil.

TAICHUNG, TAIWAN -- Foxconn plans to invest millions of dollars in a new facility here to build robots for use in medical applications and other factory automation equipment.

Read more ...

SHENZHEN – Nam Tai Electronics reported third-quarter net income fell 86% year-over-year to $1.1 million on a change in the electronics manufacturing company’s focus to lower margin products.

Read more ...

WASHINGTON, DC — The 90-day moving average worldwide semiconductor sales rose 2.1% year-over-year in the September quarter, the Semiconductor Industry Association said today.

Read more ...

TORRANCE, CASeika Machinery said an independent lab has confirmed its Solder Paste Recycling machine is capable of producing pure solder ingots from solder paste.

The ingots produced by the SPR Unit are reportedly 100% pure, with no additives or impurities added to the solder paste during the recycling process. The system removes the flux from the metal and produces a flux-free ingot. There are no voids inside the solder ingots, says Seika.

A number of analyses were performed, including Fourier Transform Infrared Spectroscopy, Inductively Coupled Plasma technique, and Scanning Electron Microscopy.

The machine enables 100% of the metal content of waste solder paste to be recovered as solder bar, the firm says.

Page 1358 of 2495

Don't have an account yet? Register Now!

Sign in to your account