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BANGKOK -- Electronics manufacturing services firm Fabrinet reported fiscal third quarter GAAP net income rose 23% year-over-year to $16.7 million, setting a company record.

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NEWARK, NH -- IEC Electronics reported fiscal second-quarter net income of $1.75 million, up 68% from last year.

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TEMPE, AZ – Economic activity in the manufacturing sector expanded in April for the 21st consecutive month, says the Institute for supply management. The PMI was down 0.8 percentage points to 60.4%. New orders were 61.7%, down 1.6 percentage points, while production dipped 5.2 points to 63.8%. Inventories were up 6.2 percentage points to 53.6%, and customer inventories were up 1 point to 40.5%. Backlogs reached 61%, up 8.5 points.

“The recent trend of rapid growth in the manufacturing sector continued in April, as the PMI registered above 60% for the fourth consecutive month. The New Orders and Production Indexes continue to drive the PMI, as they have both exceeded 60% for five consecutive months. Manufacturing employment appears to have developed significant momentum, as the Employment Index readings for the first four months of 2011 are the highest readings in the last 38 years. Inventory growth also took place in April after two months of destocking; however, the inventory restocking would appear to be necessitated by the strong performance in new orders. While the manufacturing sector is definitely performing above most expectations so far in 2011, manufacturers are experiencing significant cost pressures from commodities and other inputs,” said Norbert J. Ore, spokesperson for ISM.

The overall economy grew for the 23rd consecutive month, says the firm.

BANNOCKBURN, ILIPC has released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the design, assembly, inspection, repair, and reliability issues associated with bottom termination components whose external connections consist of metalized terminals that are an integral part of the component body.

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NEVADA CITY, CA – A new report offers an in-depth look at the worldwide integrated circuit packaging market.

The Worldwide IC Packaging Market, 2011 Edition, provides individual IC device market forecasts for units, revenue and ASP, from 2008 through 2014. It was authored by New Venture Research.

The package solutions for each of these markets are forecast, broken down into I/O ranges. Package types are rolled up to deliver an overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions. 

Major package families include dual in-line package; small outline transistor; small outline; thin small outline package; dual flat pack no lead; chip carrier; quad flat pack; quad flat pack no lead; pin grid array; ball grid array; fine-pitched ball grid array, and wafer-level package.

Also, unit forecasts for die mounted using direct chip attach methods were developed. DCA methods include chip on board, flip chip on board, chip on glass, flip chip on glass, and tape automated bonding/tape carrier package.

The contract IC packaging market is forecast, and units and revenue are analyzed by package family. Profiles of individual contract IC package assemblers are also provided. 

FRAMINGHAM, MA – The worldwide mobile phone market grew 19.8% year-over-year in the first quarter of 2011, says the International Data Corp.

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