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BANNOCKBURN, IL – IPC bestowed its highest corporate honors on Raytheon Co. and DuPont yesterday, citing the firms for their contributions to the trade group.

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LAS VEGASJuki executive Bob Black received the IPC President’s Award at Apex this week.

The award is presented to IPC members who have exhibited ongoing leadership in IPC, and have made significant contributions to the association and the electronics interconnect industry.

President and CEO of Juki Automation Systems, Black has nearly 35 years of senior executive management experience in the circuit board and semiconductor industries. He has provided leadership over the past 20 years to the industry and IPC through the Surface Mount Council, the Surface Mount Equipment Manufacturers Association steering committee and the IPC Apex Trade Show Subcommittee.

Black is a current IPC board member, serving a four-year term.

LAS VEGAS – Circuits Assembly yesterday announced the winners of its 2010 Service Excellence Awards (SEAs) for Electronics manufacturing services (EMS) providers and Electronics Assembly Equipment, Materials and Software suppliers.

 

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LAS VEGAS -- Heraeus will cease solder production at its North American manufacturing facilities, CIRCUITS ASSEMBLY has learned.

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BANNOCKBURN, ILIPC published IPC-A-600H, Acceptability of Printed Boards, and IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards.

IPC-A-600H features 95 new and updated photos and illustrations, for a total of 326. The standard offers expanded coverage on topics such as solder mask coverage, etchback, plated-hole wall integrity, via fill, and flexible circuits. It also addresses copper cap-plating of vias and copper-wrap plating.

Criterion for how much a flex circuit can be bent or folded is now available. The document addresses coverlays sometimes used to protect flex circuits.

IPC-6012C addresses determining how many boards and/or test coupons to check. A document used for specifying circuit boards, IPC-6012 details frequency of inspection, instructing how many panels must be examined within a production lot for a given performance class.

Before the completion of the latest revisions, the standards’ next series of enhancements were being planned, including finer geometries, high-density PCBs, the proximity of microvias and stacked microvias that go from one layer to another.
COLLEGE PARK, MD -- DfR Solutions and ARINC have created a partnership to provide reliability and DMSMS support to the commercial government and defense industries. Read more ...

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