WASHINGTON — The Semiconductor Industry Association (SIA) and the Boston Consulting Group (BCG) have released a report finding continued US leadership in semiconductor design – the critical and high-value-add mapping of a chip’s intricate circuitry – is essential to America’s sustained leadership in semiconductors and the many technologies they enable. The report, titled “The Growing Challenge of Semiconductor Design Leadership,” identifies three key challenges facing the US chip design sector and highlights opportunities to strengthen America’s position as a global semiconductor innovation and workforce leader.

MILPITAS, CA – Global semiconductor equipment billings rose 7% year-over-year to $28.75 billion in the third quarter, SEMI announced today.

ATLANTA — The ECIA’s Global Industry Practices Committee (GIPC) has published a document to update members on best practices as companies in the electronic components industry respond to the shifting political landscape regarding China tariffs.

AUSTIN, TX — TechSearch International's latest Advanced Packaging Update describes some of the thermal challenges facing the industry from mobile to high-performance computing. With increased power dissipation, companies are moving to higher performance thermal interface materials and adopting new cooling methods including liquid immersion.