The missile’s shock and vibration mandated a new technology: a wire-bonded, solderless PCB.
Press Releases
- Naprotek Announces Freddie Chavez as VP of Business Development
- Exhibitor Registration and Speaker Applications Now Open for NEDME 2025
- Indium Corporation Experts to Present on Solder and Thermal Solutions at Apex 2025
- Transition Automation to Showcase Expanding Line of Permalex Squeegee Products at IPC Apex