Circuits Assembly Online Magazine - Features

Packages are changing, forcing SPI, AOI and test to keep up.

Design, process and reliability implications of each major type of flux formulation.

A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.

Even for humidity-soaked boards, the culprit is barrel cracking.

A SnBiX solder showed a melting point of about 186°C and cut the material cost.

Improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.

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Press Releases

AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
STI Electronics, Inc. Achieves ISO 13485:2016 Certification, Demonstrating Commitment to Quality in Medical Device Manufacturing
Indium Corporation to Showcase Solder Products, New Flux-Cored Wire Formula at SMTA International
Saki Strengthens Presence in India

Evolving Packages Drive Test and Inspection

Packages are changing, forcing SPI, AOI and test to keep up.

Wave Soldering Flux Selection for Pb-Free Assembly

Design, process and reliability implications of each major type of flux formulation.

Mathematical Modeling of Solder Paste Stenciling for Process Control

A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.

Blowholes in Pb-Free Wave Soldering

Even for humidity-soaked boards, the culprit is barrel cracking.

A Novel Low Melting Point Pb-Free Solder

A SnBiX solder showed a melting point of about 186°C and cut the material cost.

Extending Tip Life in Pb-Free Hand Soldering

Improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.

Press Releases

POPULAR

Evolving Packages Drive Test and Inspection

Packages are changing, forcing SPI, AOI and test to keep up.

Wave Soldering Flux Selection for Pb-Free Assembly

Design, process and reliability implications of each major type of flux formulation.

Mathematical Modeling of Solder Paste Stenciling for Process Control

A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.

Blowholes in Pb-Free Wave Soldering

Even for humidity-soaked boards, the culprit is barrel cracking.

A Novel Low Melting Point Pb-Free Solder

A SnBiX solder showed a melting point of about 186°C and cut the material cost.

Extending Tip Life in Pb-Free Hand Soldering

Improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.

Press Releases

POPULAR

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