A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.
Improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.
Press Releases
- Kongsberg Awards NOK109M Order to Kitron for Tactical Communication Products
- Koh Young Showcases Inspection Innovations at IPC Apex 2025 in Anaheim, California during March 18-20, 2025
- Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
- AIM Solder Partners with Performance Technologies Group, Inc. For Sales Representation in Northeast US