Circuits Assembly Online Magazine - Features

Packages are changing, forcing SPI, AOI and test to keep up.

Design, process and reliability implications of each major type of flux formulation.

A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.

Even for humidity-soaked boards, the culprit is barrel cracking.

A SnBiX solder showed a melting point of about 186°C and cut the material cost.

Improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.

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Press Releases

ViTrox Americas Expands and Upgrades Its ViTrox Demo Center (VDC); Sy Creed Comments
SisTech Manufacturing Selects Europlacer to Power High-Mix, High-Reliability Growth
Q Source Announces New Partnership with C2V to Expand Safety Solutions Offering
Altus Helps FermionX Enhance Production with Advanced Inspection Solutions; Joe Booth and Will Patrick Comment

Evolving Packages Drive Test and Inspection

Packages are changing, forcing SPI, AOI and test to keep up.

Wave Soldering Flux Selection for Pb-Free Assembly

Design, process and reliability implications of each major type of flux formulation.

Mathematical Modeling of Solder Paste Stenciling for Process Control

A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.

Blowholes in Pb-Free Wave Soldering

Even for humidity-soaked boards, the culprit is barrel cracking.

A Novel Low Melting Point Pb-Free Solder

A SnBiX solder showed a melting point of about 186°C and cut the material cost.

Extending Tip Life in Pb-Free Hand Soldering

Improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.

Press Releases

POPULAR

Evolving Packages Drive Test and Inspection

Packages are changing, forcing SPI, AOI and test to keep up.

Wave Soldering Flux Selection for Pb-Free Assembly

Design, process and reliability implications of each major type of flux formulation.

Mathematical Modeling of Solder Paste Stenciling for Process Control

A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.

Blowholes in Pb-Free Wave Soldering

Even for humidity-soaked boards, the culprit is barrel cracking.

A Novel Low Melting Point Pb-Free Solder

A SnBiX solder showed a melting point of about 186°C and cut the material cost.

Extending Tip Life in Pb-Free Hand Soldering

Improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.

Press Releases

POPULAR

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