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Editorial
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Magazine articles
Evaluating ROI of AXI vs. AOI
Details
Written by
Keith Fairchild
Published: 12 September 2006
A model for calculating savings from reduced DPMO against equipment investment costs.
Read more ...
Programming and the Problem of Yield
Details
Written by
Nick Deppen, Erik Orwoll and Robert Duff
Published: 29 August 2006
Optimized sockets should combine the durability and signal integrity of test sockets and the standardization (and cost) of burn-in versions.
Read more ...
Cleaning Flux Residue in Hand Solder Rework and the Effects on SIR
Details
Written by
Curt Alexander
Published: 29 August 2006
SIR endpoint readings tend to be higher following IPA cleaning.
Read more ...
Speedline MPM's New Inspection Tool
Details
Written by
Staff
Published: 29 August 2006
Read more ...
Environmental and Mechanical Stress Testing of Pb-Free and SnPb Solder
Details
Written by
Larry Fisher
Published: 29 August 2006
Pb-free beats SnPb on lead pull, but not shear force.
Read more ...
The New Era
Details
Written by
E. Jan Vardaman
Published: 29 August 2006
How IC packaging and assembly houses have refined their business model.
Read more ...
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Press Releases
Naprotek Announces Freddie Chavez as VP of Business Development
Exhibitor Registration and Speaker Applications Now Open for NEDME 2025
Indium Corporation Experts to Present on Solder and Thermal Solutions at Apex 2025
Transition Automation to Showcase Expanding Line of Permalex Squeegee Products at IPC Apex
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How Squeegee Blade Profile Helps Improve the Screen-Printing Process
Is the Industry Ready for a Solderless World?
The Benefits of Nitrogen in PCB Soldering
Verifying PCBA Cleanliness with Ion Chromatography
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