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Editorial
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Magazine articles
Evaluating ROI of AXI vs. AOI
Details
Written by
Keith Fairchild
Published: 12 September 2006
A model for calculating savings from reduced DPMO against equipment investment costs.
Read more ...
Programming and the Problem of Yield
Details
Written by
Nick Deppen, Erik Orwoll and Robert Duff
Published: 29 August 2006
Optimized sockets should combine the durability and signal integrity of test sockets and the standardization (and cost) of burn-in versions.
Read more ...
Cleaning Flux Residue in Hand Solder Rework and the Effects on SIR
Details
Written by
Curt Alexander
Published: 29 August 2006
SIR endpoint readings tend to be higher following IPA cleaning.
Read more ...
Speedline MPM's New Inspection Tool
Details
Written by
Staff
Published: 29 August 2006
Read more ...
Environmental and Mechanical Stress Testing of Pb-Free and SnPb Solder
Details
Written by
Larry Fisher
Published: 29 August 2006
Pb-free beats SnPb on lead pull, but not shear force.
Read more ...
The New Era
Details
Written by
E. Jan Vardaman
Published: 29 August 2006
How IC packaging and assembly houses have refined their business model.
Read more ...
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OCTOBER ISSUE
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Edition Here!
Press Releases
Aegis Software Expands its Presence in France and Partners with STPGroup
Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up
Fuji America Promotes Chris Dayney to Technical Marketing Manager, Expanding Focus on Premium Technical Content
BTU International Announces Strategic Manufacturing Expansion in Singapore to Strengthen Global Supply Chain
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Editorial Contributions
Tracking Giants: Inside the World’s Top PCB Fabricators
Verifying PCBA Cleanliness with Ion Chromatography
Cold Paste, Hot Mess
Among PCB Design, Raises are Up, Benefits are Down and Deadlines Don’t Budge
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