Circuits Assembly Online Magazine - New Products

News

SAN JOSE – University of California-Berkeley professor Dr. Luke P. Lee will unveil the future of medical innovations through functional BioPOETIC (Biologically-inspired Photonics-Optofluidics-Electronics Technology-based IC) devices and packaging when he keynotes the MEMS Packaging Symposium this month.

The symposium is sponsored by the MicroElectronics Packaging and Test Engineering Council (Meptec), which announced the final program is in place. MEMS Market Evolution: From Technology Push to Market Pull takes place May 22, in San Jose.

Other presentations include sessions on consumer and automotive applications:

Karen Lightman, managing director, MEMS Industry Group, on findings and recommendations from METRIC 2008, the annual meeting for members of MEMS Industry Group.
Moshe Gat, R&D section manager, Wireless Semiconductor Division, Avago Technologies, Size Reduction and Integration of RF filters in Cellular Phones.
Ken Yang, Ph.D., advanced MEMS development manager, Analog Devices, Three-Axis Motion Sensor Development and Production for Consumer Electronics Market.
Aaron Partridge, chief science officer, SiTime, MEMS Timing – More Function in a Smaller Package.
Janusz Bryzek, LV Sensors, Inc. / Joseph R. Mallon, Jr., Exept/Stanford University, Green Killer Application: Wireless Tire Pressure Monitoring.
Jonathan Rheaume, Research Specialist, UC Berkeley, Micro-Printed Solid State Electrochemical Sensor for Monitoring Lean Direct Injection Engines.
Venkataraman Chandrasekaran, senior design engineer, Sensata Technologies, Sensors at Sensata: Recent and Emerging Applications in Powertrain and Safety Systems.

Other sessions cover wafer-level packaging and 3D ICs and MEMS and Biomedicine.

For information: meptec.org.

JASPER, IN – Kimball International today reported a fiscal third-quarter net loss from continuing operations of $900,000 on net sales of $332.1 million. For the quarter ended March 31, sales were up 7%, but earnings fell 120%.

SMYRNA, GA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, will broadcast "Optimize System Performance with FPGA/PCB Co-Design," a 45-minute free Webinar, on June 3, at 2 PM EDT.

Bob Potock, director of FPGA marketing for Mentor Graphics, Systems Design Division, will discuss how new FPGA/PCB concurrent design processes and tools can significantly improve system performance and product costs, as well as designer productivity. Attendees will learn the elements of an effective FPGA on-board strategy, how to boost productivity and PCB quality, and be introduced to specific implementation options.

This event is the third in a series of Webinars addressing how to efficiently design today’s increasingly complex PCBs in the competitive electronics industry.

To register, visit http://www.pcbshows.com/webinars.

HAUPPAUGE, NY –API Nanotronics Corp. has named Steve Pudles chief executive officer. He succeeds Phillip DeZwirek, who remains chairman.

Pudles is the former CEO and president of Nu Visions Manufacturing, where he led the company from $10 million in revenue to more than $100 million in a six-year period. He has 25 years’ electronics industry experience.

API supplies electronic components and conducts nanotechnology R&D for the defense and communications sectors.

Pudles has worked for a number of EMS firms and was recently elected secretary and treasurer of the IPC board.

ENDICOTT, NY – The U.S. Department of Defense has awarded Endicott Interconnect Technologies a $148.6 million contract modification to its current program to supply finished assemblies for a high-reliability, high-performance computing application.

Under the deal, EI produces card frame assemblies, including HyperBGA organic semiconductor packaging, multichip module assemblies, PCBs, functionally tested assemblies, and supplies engineering services.

The contract modification period is from May to December this year.