News
ALAMEDA, CA – The industry can expect reasonable growth over the next five years for aerospace, defense, and homeland security electronics, says Technology Forecasters Inc.
FOSTER CITY, CA – “Outsource manufacturing is becoming the de facto strategy.”
So says PLM software provider Arena Solutions, which, with Symphony Consulting on Tuesday, announced results of their joint outsourcing survey.
So says PLM software provider Arena Solutions, which, with Symphony Consulting on Tuesday, announced results of their joint outsourcing survey.
ROME, NY – The ESDA requests abstracts for technical papers covering the effects of electrostatic discharge, electrical overstress, and static electricity for presentation at its 30th Annual EOS/ESD Symposium, Sept. 7-12, 2008 in Tucson, AZ.
Papers are being accepted in the following areas: component level EOS/ESD; system level EOS/ESD; EOS/ESD factory level and materials technology; electrostatic considerations; magnetic recording heads; ultra-sensitive devices, and ESD standards components, systems and factory.
The deadline for submission of 50-word abstracts and four-page (max.) summaries is Jan. 11.
The submission deadline for the finished paper is June 6. Final papers will be limited to a maximum of 10 pages.
To obtain copies of the call for papers, email info@esda.org or visit www.esda.org.
LOUISVILLE — Robert B. Sanders, president of Sypris Solutions Inc.'s electronics division, has resigned effective Sept. 24.
He joined Sypris in 2005 from Honeywell, where he was general manager for the company's Defense & Space Electronics Systems division.
He joined Sypris in 2005 from Honeywell, where he was general manager for the company's Defense & Space Electronics Systems division.
Vice president and CFO Scott Hatton will absorb Sanders' responsibilities until a replacement is found.
WASHINGTON – The U.S. House of Representatives has passed H.R. 1908, also known as the Patent Reform Act of 2007, the first step toward bringing the nation's patent laws in line with international statutes.
ANAHEIM, CA – Dan Baldwin, PhD, founder and president of Engent Inc. and Adjunct Professor of Georgia Tech Institute will speak on Sept. 29 about an Experimental Wetting Dynamics Study Of Eutectic and Lead-Free Solders.
This SMTA LA/OC Chapter meeting will take place at the Embassy Suites Hotel, Anaheim, at 6 p.m.
The effects of solder reflow process parameters and bonding materials will be discussed, as they relate to the physics of solder wetting and the interconnect process yield and solder joint reliability.
The experimental setup consists of a high-speed image acquisition system and a temperature chamber that were used to measure the time-dependent behavior of molten solder spheres onto bond pads under an isothermal condition. The solder materials investigated are eutectic tin-lead solder and lead-free 95.5Sn-4.0Ag-0.5Cu solder. The wetting dynamics of the solder materials were investigated on Cu, Cu/OSP, and Cu/Ni/Au bond pads, with several different flux systems, at different environmental temperatures, with various solder sphere sizes.
The experimental observations indicate that the wetting dynamics clearly depend on temperature, solder materials and substrate metallization, but do not depend significantly on the flux system or the solder sphere size.
Visit www.laocsmta.org for more information.
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