News
SAN JOSE – SEMI today reported worldwide semiconductor manufacturing equipment billings reached $11.1 billion in the second quarter. The figure is up 3% sequentially, and about 15% year-over-year.
TAIPEI — Foxconn Electronics reported July non-consolidated revenues of $2.93 billion, up 2.6% sequentially and 39.5% year-over-year, on demand for consumer electronics, PCs and networking devices.
ARLINGTON, VA — Electronic component orders rose in July, boosted by a late rush in June that carried over into the next month, according to the latest monthly average compiled by the Electronic Components, Assemblies & Materials Association.
The 12-month average remained relatively flat, the trade group said.
Orders began picking up momentum in the last weeks of June and continued throughout July, maintaining a pattern of summer acceleration seen in past years.
In a statement, ECA president Bob Willis said, “It looks as if we are on the way to the third straight year of order growth."
The 12-month average remained relatively flat, the trade group said.
Orders began picking up momentum in the last weeks of June and continued throughout July, maintaining a pattern of summer acceleration seen in past years.
In a statement, ECA president Bob Willis said, “It looks as if we are on the way to the third straight year of order growth."
FRANKLIN, MA – On Sept. 13, Speedline Technologies will offer a Webcast on high-speed solder paste inspection techniques and tools. The one-hour presentation will start at 11 am EST.
Various inspection techniques and tools are available for process verification and defect detection. Specific areas of discussion will include process design, process control factors to limit defects, and inspection/process equipment available to discover defects as early as possible. Capabilities and benefits of printer 2-D inspection and 3-D AOI will be reviewed.
To register, visit www.speedlinetech.com/seminars.
LAKE FOREST, CA — EMS company Probe Manufacturing reported second-quarter sales fell 50% year-over-year to $1.8 million. Net profits rose 510% to $336,627 for the period ended June 30.
Cash from operations was $161,796, up from $44,143 for the same period in 2006. Debt was cut by $452,055.
Probe reported sales of $1.9 million in the March quarter.
"We are pleased with our results, as we marked the seventh consecutive quarter of positive net income from operations and debt reduction," said Probe CEO Reza Zarif.
For the quarter, half the revenue came from medical, aerospace and alternative energy business, up from 20% in 2006. Probe seeks to focus on the medical device manufacturing, aerospace and alternative energy industries, which management believes to be more stable and less likely to move offshore. Five customers accounted for approximately 77% of sales in the quarter, compared to 93% in 2006.
Cash from operations was $161,796, up from $44,143 for the same period in 2006. Debt was cut by $452,055.
Probe reported sales of $1.9 million in the March quarter.
"We are pleased with our results, as we marked the seventh consecutive quarter of positive net income from operations and debt reduction," said Probe CEO Reza Zarif.
For the quarter, half the revenue came from medical, aerospace and alternative energy business, up from 20% in 2006. Probe seeks to focus on the medical device manufacturing, aerospace and alternative energy industries, which management believes to be more stable and less likely to move offshore. Five customers accounted for approximately 77% of sales in the quarter, compared to 93% in 2006.
SHENZHEN – SMTA China announced it will sponsor the upcoming SMTA China South Conference 2007. Reed Exhibitions will support the conference in conjunction with the Nepcon China 2007 exhibition at the Shenzhen Convention & Exhibition Center.
It is scheduled to take place Aug. 27-30 in Shenzhen, China.
It is scheduled to take place Aug. 27-30 in Shenzhen, China.
This event will feature technical papers, workshops and training sessions, as well as the Emerging Technologies Summit and three symposia across seven tracks: manufacturing and assembly, advanced packaging, substrates, soldering, test/inspection/quality, process Control, and contract manufacturing/business issues.
Conference topics include 01005 assembly, 3-D system in package (SiP), package on package (PoP), Pb-free reliability, component supply integrity, legal responsibility of non-RoHS part/product entering Europe, materials and process characterization, and flex circuit assembly.
For more information and to register, contact Peggy Chen at +86-21-5609-3010 or peggy@smta.org.
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