caLogo

News

THIEF RIVER FALLS, MN Digi-Key Corp. has signed a deal to distribute the integrated antenna product line of Cambridge, UK-based Antenova Ltd. Digi-Key will sell the products globally.

Antenova's radio antenna modules and other products are used in wireless applications such as mobile handsets, portable devices and other consumer electronics.

Antenova products are available for purchase directly from Digi-Key and are featured in its print and online catalogs.

In a statement, Digi-Key president and COO Mark Larson said, “ “We are very excited to add this innovative company to our line card. I am certain that the rapid design and ease of use benefits of Antenova’s products will be of consequential interest and appeal to our customers.”

“Antenova is proud to be working with Digi-Key to further grow our customer base,” said David Nuti, North American sales manager for Antenova. “This agreement underpins our commitment to providing the best integrated antenna solutions and support to our global handset, portable device and laptop computer customers and partners.”

 

SANTA CLARA, CA -- More than 400 industry insiders gathered here yesterday for Microsoft's first Global High Tech Summit, a forum that looked at challenges and trends facing high tech manufacturing.

In a joint effort to improve supplier collaboration, Microsoft and Intel announced proposals for the next-generation of open, interoperable business standards for small-to-medium enterprise supplier collaboration, based on the Office Open XML formats.

Under the management of the open standards body Ecma International, the Open XML document formats are now being finalized as a worldwide standard by leading tech companies including Intel. The document format standard offers flexible support for integration external XML information, which is critical to RosettaNet requirements.

Also announced was the establishment of a customer advisory board composed of companies representing various market segments, including Applied Materials, Flextronics, Juniper Networks, Nvidia, Xilinx and others.
Electronics Workbench will sponsor a free Webinar on enhanced schematic capture during PCB layout using specific software tools.

The one-hour online event takes place Oct. 3, at 9 and 3 EST.

Topics to be covered include the company's Ultiboard interface, advanced routing and placement, managing design constraints, exporting industry standard formats and more. To register, visit http://www.electronicsworkbench.com/news/pronews3b.html.
TAIPEI -- BenQ Corp.'s German handset unit is considering filing for insolvency after its board decided to halt funding to the division. BenQ's cellphone units in Brazil and elsewhere are also reviewing their financial positions, according to reports.

Read more ...
WOODRIDGE, IL – Morey Corp. will build a state-of-the-art technical research and design facility next year near the EMS company's headquarters in Woodridge. The site will assist Morey’s telematics, controller, and display product lines.

Plans call for a 26,300-sq. ft., two-story facility to be located adjacent to the company’s headquarters.

Read more ...
SAN JOSE – MEPTEC, the MicroElectronics Packaging and Test Engineering Council, will hold its annual packaging roadmaps symposium Nov. 16 in San Jose.

IC Packaging & Test Roadmaps: Device Trends Impact on Packaging & Test Technology and Supply Chain, the annual roadmap symposium, will overlay IC device trends with the associated current and future technology solutions for packaging and test and will also explore challenges associated with demands for full turnkey supply chain services.

For more information, visit www.meptec.org.

Page 2160 of 2506

Don't have an account yet? Register Now!

Sign in to your account