News
FRANKFURT -- Consolidation continued in the telecom space as Nokia and Siemens announced the combining of heir mobile-network operations to create a 50:50 joint venture with annual revenue of about $20 billion.
The new entity will be called Nokia Siemens Networks and is expected to be finalized by year-end, pending regulatory approval.
The new entity will be called Nokia Siemens Networks and is expected to be finalized by year-end, pending regulatory approval.
CeTaQ Americas has expanded machine performance verification services to include verifying placement of very tiny passive chip components to 01005 size. Such components, loaded from tape and reel, are difficult to place accurately and repeatably, and require that placement equipment operate within tight performance tolerances and accuracy to minimize defects.
General manager Mike Sivigny said, “These chips are so tiny that pad dimensions and geometries are measured in microns. If a placement machine is not operating fully within a manufacturer’s stated accuracies, there will be a higher rate of defects and reduced yields. These components are already responsible for higher defect levels than larger scale components, and are the focus of considerable process optimization efforts within the industry. Additionally, their tiny size makes manual rework difficult, compounding the negative impact of defects caused by inaccurate placement.”
The most common problems found on chip placement equipment, Sivigny adds, are systematic offsets, per head, per nozzle, per angle or simply a general offset. Offsets negatively affect chip shooter accuracy, resulting in PCB defects, lower yields, and costly manual rework. With growing demand for 01005 chip usage, placement accuracy is increasingly important.
General manager Mike Sivigny said, “These chips are so tiny that pad dimensions and geometries are measured in microns. If a placement machine is not operating fully within a manufacturer’s stated accuracies, there will be a higher rate of defects and reduced yields. These components are already responsible for higher defect levels than larger scale components, and are the focus of considerable process optimization efforts within the industry. Additionally, their tiny size makes manual rework difficult, compounding the negative impact of defects caused by inaccurate placement.”
The most common problems found on chip placement equipment, Sivigny adds, are systematic offsets, per head, per nozzle, per angle or simply a general offset. Offsets negatively affect chip shooter accuracy, resulting in PCB defects, lower yields, and costly manual rework. With growing demand for 01005 chip usage, placement accuracy is increasingly important.
MINNEAPOLIS, MN – The SMTA is offering two more process certification workshops in 2006. Each SMTA Certification program, one for SMT Processes and one for Six Sigma Green Belt, is a three-day workshop consisting of refresher topics and examinations. The workshop assumes that the participant has at least 2-3 years of SMT experience and has an educational background equivalent to two years or more of college in a technical discipline.
SMTA Certification is not an entry-level program. Basic algebra and statistics will be used in the workshop and examination. The examination requires written answers and some calculations.
Remaining programs include:
SMT Processes Certification
August 22-24
Heraeus, Inc. - West Conshohocken, PA
SMT Processes & Six Sigma Certification
September 25-28
Donald Stephens Convention Center - Rosemount, IL
For full details, visit http://www.smta.org/certification/certification.cfm
SMTA Certification is not an entry-level program. Basic algebra and statistics will be used in the workshop and examination. The examination requires written answers and some calculations.
Remaining programs include:
SMT Processes Certification
August 22-24
Heraeus, Inc. - West Conshohocken, PA
SMT Processes & Six Sigma Certification
September 25-28
Donald Stephens Convention Center - Rosemount, IL
For full details, visit http://www.smta.org/certification/certification.cfm
BRUSSELS -- A new study from the University of Würzburg undertaken for the EU FIRE project confirms the conclusion that TBBPA poses no health risks.
Previous studies on TBBPA carried out under the EU FIRE project have reached the same conclusion, as did the EU human health risk assessment report which identified no risk to human health.
TBBPA is used to comply with global fire safety requirements mainly as a reactive chemical in epoxy resins of FR4 PCB laminates and as an additive to ABS plastics.
Results of the study of tetrabromobisphenol A (TBBPA) in human and rats after oral administration suggest a very low systemic bioavailability of TBBPA after oral administration due to efficient hepatic metabolism and biliary excretion of conjugates formed.
Previous studies on TBBPA carried out under the EU FIRE project have reached the same conclusion, as did the EU human health risk assessment report which identified no risk to human health.
TBBPA is used to comply with global fire safety requirements mainly as a reactive chemical in epoxy resins of FR4 PCB laminates and as an additive to ABS plastics.
Results of the study of tetrabromobisphenol A (TBBPA) in human and rats after oral administration suggest a very low systemic bioavailability of TBBPA after oral administration due to efficient hepatic metabolism and biliary excretion of conjugates formed.
SAN DIEGO -- Goodwill Industries of San Diego County and Dell have introduced Reconnect San Diego, a free drop-off program to recycle unwanted computers. The pilot program aims to divert at least 2 million pounds of used computers and computer equipment from landfills over one year and to provide consumer education on the importance of proper computer disposal -- while creating job opportunities for individuals with disabilities and other employment barriers.
San Diego residents can visit www.reconnectpartnership.com or www.sdgoodwill.org to locate a convenient Goodwill donation centers. Goodwill will sort the donated computer equipment, which will be recycled through the Dell Asset Recovery Services value recovery program. Dell's authorized product recovery partner will remarket the recycled materials, such as plastics, glass and metals, and all sales proceeds will go to Goodwill to support the non-profit's job training and employment services programs.
“This new alliance will really expand our existing electronics recycling program and further Goodwill’s mission at the same time," said Mike Rowan, CEO of Goodwill Industries of San Diego County. “Working with Dell will help us ensure we are implementing the latest environmentally sound recycling practices.”
Reconnect San Diego is the latest in a series of Dell environmental initiatives to raise awareness of the importance of responsibly recycling computers and increase recycling participation rates. Other Reconnect pilot programs are under way in Central Texas, Michigan and the San Francisco Bay area.
San Diego residents can visit www.reconnectpartnership.com or www.sdgoodwill.org to locate a convenient Goodwill donation centers. Goodwill will sort the donated computer equipment, which will be recycled through the Dell Asset Recovery Services value recovery program. Dell's authorized product recovery partner will remarket the recycled materials, such as plastics, glass and metals, and all sales proceeds will go to Goodwill to support the non-profit's job training and employment services programs.
“This new alliance will really expand our existing electronics recycling program and further Goodwill’s mission at the same time," said Mike Rowan, CEO of Goodwill Industries of San Diego County. “Working with Dell will help us ensure we are implementing the latest environmentally sound recycling practices.”
Reconnect San Diego is the latest in a series of Dell environmental initiatives to raise awareness of the importance of responsibly recycling computers and increase recycling participation rates. Other Reconnect pilot programs are under way in Central Texas, Michigan and the San Francisco Bay area.
TAIPEI -- Foxconn
Electronics, the world's largest EMS provider, will add three global
regional offices in Asia this year, the Chinese-language Apple Daily is reporting.
The move would bring the company's total 17.
The move would bring the company's total 17.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing