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Norcross, GA, Dec. 1, 2004 ¾ The Electronics Assembly Systems division of Siemens Logistics and Assembly Systems Inc. is providing a Lean Manufacturing course for the Americas. The first two-day course is scheduled for Jan. 26-27, 2005, in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at the Rochester Institute of Technology (RIT).

The course will take place at RIT's Rochester, NY, CEMA facility. The following Lean tools will be discussed: Value Stream Mapping (VSM); 5-S; Visual Controls; Standard Work; Takt; Kanban, Pull Systems and Supermarkets; Line and Cell Design; Setup Reduction, Total Productive Maintenance (TPM); Kaizen Event Training; Impact and Culture Change; and Assessment Tools.

The course is being offered as a result of the Siemens EA Consortium for the Advancement of Electronics Manufacturing Education (CAEME).

BANNOCKBURN, IL, Dec. 1, 2004- The North American book-to-bill ratio for rigid and flexible boards dipped slightly to 1.05 in October, according to IPC. It had been 1.08 in September. Shipments and bookings both dropped notably from the previous month.

The ratio is based on data collected from rigid PCB and flexible circuit producers that participate in IPC's statistical program. The ratio is calculated by dividing the value of orders booked over the past three months by the value of sales billed. A ratio over 1.0 is considered an indicator of rising demand.

Separately, the ratios were 0.94 for rigid PCBs and 1.48 for flexible circuits.

In October, combined shipments increased 15.3% year-on-year, with bookings up 2.7%.

PCB shipments are up 31.5% year-to-date, and bookings are up 31.4%.

However, shipments and bookings are both down from September, falling 15.5% and 16.8%, respectively.

Year-on-year, rigid PCB shipments are up 3.3% and bookings are down 20.0%. Shipments and bookings are both up year-to-date, increasing by 21.2% and 12.6%, but are both down sequentially, decreasing 18.7% and 16.7%, respectively.

Flexible circuit shipments are up 48.6% and bookings are up 81.5% year-on-year. Year-to-date, flexible shipments and bookings have grown 74.4% and 103.1%. Sequentially, flex shipments decreased 1.9% and bookings are down 17.2%.

Flexible circuit sales, which include some value-added services in addition to the bare flex circuits, represent about 17% of total PCB sales in IPC's survey sample.

In a press release, IPC cautioned that month-to-month comparisons should be made with caution as they may reflect cyclical effects.

Carlsbad, CA — Asymtek is holding a conformal coating and dispensing workshop on Wednesday, Dec. 8, at the Center for Board Assembly Research, Manufacturing Research Center (MARC) of the Georgia Institute of Technology in Atlanta. The hands-on workshop will feature demonstrations from Asymtek and presentations from Dow Corning, Georgia Tech, Emerson and Cuming, Henkel Technologies, Humiseal, Heraeus and Nordson.

Speakers will review the best practices for coating, jetting and other electronics assembly dispensing from both material and equipment perspectives.

For more information on the free event, visit: www.asymtek.com/news/seminars/southeast_2004 or call 1-800-ASYMTEK, ext. 8496.

Jersey City, NJ, Nov. 29, 2004 - Cookson Electronics Assembly Materials and Automated Learning Corp. (ALC) have launched a series of lead-free assembly training courses.

The courses are part of ALC's Learntech series, a modular interactive multimedia learning approach designed for process engineers, managers and senior operators involved in the implementation and management of lead-free electronic assembly processes.

Business Electronic Soldering Technologies (BEST) is a key contributor in the first product in the suite -- Lead-Free Soldering: Orientation. Click here for more information.

Future lead-free training courses will cover rework, wave soldering and SMT. Translated versions will be offered in German and Chinese.

Munich, Nov. 30 - The electronica trade show in Munich earlier this month attracted more than 3,000 exhibitors and 75,000 attendees, according to event organizer Munich Trade Fairs International. These numbers are almost equal to those released regarding the last show in 2002.

Overall feedback was positive; 85% of exhibitors and attendees surveyed assessed the market's future as "excellent to good."

Non-German attendance rose 10% from the previous show, making up 42% of total visitors. According to the organizer, 86% of attendees were identified as decision-makers for their companies.

"We spent quality time with customers in a relaxed atmosphere here at our booth," said Alden Chauvin, VP of worldwide sales for Intersil, a manufacturer of high performance analog solutions. "We've had meeting after meeting and business has been great, which is no surprise at electronica."

The next electronica will take place Nov. 14-17, 2006, at the New Munich Trade Fair Centre.

Minneapolis, MN -- The SMTA has issued a call for papers for the next SMTA International event, to be held in conjunction with AT Expo on Sept. 25-29, 2005, at the Donald Stephens Convention Center in Chicago. A 300-word abstract should be submitted online by Feb. 7.

Papers are sought in the following technology tracks: assembly; business; components; emerging technologies; PCB technology; and process control

New topics for 2005 include New Materials & Processes, Battery Interaction, Lead-free Case Studies, Doing Business in Asia and RoHS Compliance. A full list of topics can be found on the SMTA Web site.