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March 21 -- The newly formed JEDEC JC64 committee will have its first meeting on June 6 in Seoul, Korea at the Shilla Hotel, immediately following the JC42.4 flash memory device committee.
 
Created by the JEDEC Board of Directors at the request of industry leaders in flash memory, the committee is focused on standardizing flash memory modules for the industry.
 
At the meeting, JC64 members will elect a chairman, establish plans for their activities and future meetings, and initiate the standardization work. Mian Quddus from Samsung has been appointed temporary chairman until elections are held.
 
All interested companies are invited to join.

Irvine, CA-- Henkel Corp. was named a recipient of Intel Corp.'s Preferred Quality Supplier (PQS) award for outstanding performance in supplying Intel with underfill and die attach paste. This is the company's third consecutive PQS award since 2001.

 

"Henkel has set an example of outstanding customer commitment with flawless support on High Value Manufacturing," said Mark Kaltenbach, Intel Director, Assembly Test Materials Organization. "In addition, Henkel has proven themselves as invaluable technology partner through their dedicated engagement and continuous improvement approach on future technologies with Intel."

 

Henkel and 25 additional PQS award winners were recognized at a celebration in Burlingame, CA, on March 15. The awards are part of Intel's Supplier Continuous Improvement (SCQI) process that encourages suppliers to strive for excellence and continuous improvement.

CHANDLER, AZ - Isola Group has acquired the assets and intellectual property of Gividi-Italy, a specialty manufacturer of fiber glass cloth for the PCB industry. The company, located in Monza Italy, has revenue of over $20 million and will report to Isola Europe. The acquisition is set to be completed during the first week of Apri. Terms were not disclosed.

"This acquisition strengthens our technology platform enabling us to expand the development of proprietary finishes used for our rapidly growing high performance products segment," said Ray Sharpe, president and CEO of Isola Group. "This investment demonstrates the commitment of our shareholders to not only the printed circuit industry, but to our new product development process as well."

The new company will be renamed to Isola Fabrics S.r.l. according to Augusto Meozzi, president Europe for Isola Group.

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Carlsbad, CA -- Asymtek, a Nordson Company, received Intel Corp.'s 2004 Supplier Continuous Quality Improvement (SCQI) award. The company was given the award for its efforts in supplying Intel with automated fluid dispensing equipment. The company also won a SCQI award in 2003.
 
Asymtek and other SCQI award winners were honored at a celebration in Burlingame, CA on March 15. Intel also recognized award winners with an advertisement in the U.S., Europe and Asian editions of the Wall Street Journal.
 
"Asymtek continues to deliver outstanding results on key programs and initiatives for Intel," said Ron Rinfret, Director of Assembly Capital Equipment Development, Intel. "For the second year in a row Asymtek has been recognized as one of the 'best of the best' suppliers at Intel.  We look forward to working with Asymtek in 2005 on additional challenging and strategic initiatives and are confident in their continued excellent support."
 
The SCQI awards are part of Intel's Supplier Continuous Quality Improvement process, which encourages key suppliers to strive for excellence and continuous improvement. 
GREENVILLE, SC -- Kemet Corp. has named electronics veteran Per-Olof Loof chief executive, effective April 4.  The company also named a new chairman.

Loof is managing partner of a New York management consulting firm. He was previously chief executive of Sensormatic Electronics, now part of Tyco. Loof also has had posts at Andersen Consulting, Digital Equipment Corporation, AT&T and NCR.
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SAN JOSE -- Tessera Technologies today raised its financial guidance for the first quarter of 2005. The company also announced a licensing deal with Fujitsu.

Tessera now expects first quarter revenue in the range of $27.3 million to $27.5 million, as compared to previous guidance of $21.5 million to $22.0 million.

Ina press release, Tessera chairman and chief executive Bruce McWilliams said, "We are revising our guidance upwards based upon the impact of new licenses signed, as well as the overall good performance from our existing licensees in the past quarter, particularly related to devices used in computing and in personal communications."

Also, today, the company signed a technology licensing agreement with Fujitsu covering chip-scale packaging in ASICs, ASSPs and system-on-chips.

The technology includes chip-scale and multichip package types. No financial details were disclosed.
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