DANBURY, CT -- BPA Consulting Ltd. and Quantum Performance Group LLC will present executive briefings on next generation interconnect technology for high speed and miniaturized systems. The briefings will take place in Newport Beach and San Jose, and Boxborough, MA, the week of April 18. 

Topics will include: 

• Next-generation systems: The demand and driving forces for innovative interconnects.
• Worldwide high-speed interconnect technology, market trends, manufacturing challenges and opportunities. 
• Flexible and rigid-flexible circuits manufacturing, materials and trends.
• The future structure and strategic implications for participants in the interconnect supply industries. 
• Asia - opportunity, threat or both?

Meetings are limited to 25 delegates to ensure a workshop-style environment. Presenters include: Mike Campbell, Dan Feinberg, Dr. Jim Hickman, Mark Hutton, Nicholas Pearne, Francesca Stern and Gene Weiner.  

For further information contact Campbell at m.campbell@bpaconsulting.com or nextgenbriefing@quantumpg.com.

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ATLANTA, GA — UP Media Group Inc. is seeking abstracts for PCB Design Conference East on Oct. 10 - 14, at The Center of New Hampshire in Manchester, NH. Sponsored by Printed Circuit Design & Manufacture and Circuits Assembly, PCB East (pcbeast.com) is a conference and exhibition for the design and manufacture of advanced circuits, PCBs and semiconductor packages.

The five-day conference is made up of a three-day Technical Conference (Tuesday - Thursday) that features short courses and papers, and two days (Monday and Friday) of Professional Development one-day and two-day courses. In addition to an exciting show floor of industry vendors, this year's show will feature free networking and special events.

Papers and/or presentations for the Technical Conference should be 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops or panel sessions, or half-day (3.5 hour) seminars. Papers and/or presentations also are sought for a Professional Development Curriculum of one-day and two-day tutorials. 

To be considered as a speaker/presenter, fill out the online submission form or send an email to Conference Chair Andy Shaughnessy: ashaughnessy@upmediagroup.com, by March 4.

Papers and presentations might cover the following topics:

- High speed, high frequency and signal integrity

- Lead-free processes and their effect on PCB design

- Impedance and crosstalk control

- EMI/EMC analysis

- Embedded passives and active devices

- Thermal analysis

- RF and microwave

- Packaging and components

- Area arrays

- FPGA design and implementation

- Flexible circuitry

- HDI design and technologies

- PCB design/layout techniques

- Component library creation and management

- Design for manufacture, test and assembly

- Design (including analog, digital and power supplies)

- PCB fabrication

- Soldering

- Surface finishes

- Industry forecasts

- Business and design/supply chain issues