BUCKS, UK – The Smart Group, a group of SMT engineers in the UK, will kick off its Silver Anniversary with a special conference and exhibition in October.
 
The event, which takes place in Oxfordshire on Oct. 22, will feature a number of speakers, including headliners Doug Pauls and Dave Hillman of Rockwell Collins, and a tabletop exhibition.
 
Other events are being planned for the year, culminating in a conference and exhibition next fall.
 
Engineers formed the Smart Group to meet the challenge of SMT. The vision has changed to embrace all the new technology developments and environmental concerns, including design, PCB manufacture, all components, assembly, test and reliability, rework and repair.
 
Further events will be announced at www.smartgroup.org. 

KUALA LUMPUR – Unisem (M) Berhad has entered into a cross-licensing agreement with ASAT Ltd., permitting each to manufacture and market the other company’s leadless packaging technologies.

Packaging technologies included are Unisem’s etched leadless package, taped leadframe package and ASAT’s thin array plastic package and thermal leadless array package.

No financial terms were disclosed.

ASAT provides semiconductor package design, assembly and test services. Unisem provides semiconductor assembly and test services.