BANNOCKBURN, IL — Total North American PCB shipments in April were up 2.1% year-over-year and down 20.4% sequentially.
PENANG – EMS firm Cnergenz reported first quarter revenue of RM36.9 million (US$8.4 million), with primary contributions from sales of SMT equipment constituting 60.9% of total revenue. Sales from the integrated solutions segment contributed 31.2%.
SUDBURY, MA – Delo posted sales of €182 million (US$195 million) in fiscal year 2022, up 9% year-over-year.
MUNICH — To better support IPC’s European members’ interests, the association formed IPC Electronics Europe.
SAN JOSE – Full turnkey production and supply chain management is now underway at the Omega EMS facility here for Eguana Technologies products.
UTTAR PRADESH, INDIA – PG Technoplast signed a memorandum of understanding with the government of Maharashtra to invest Rs 3.15 billion (US$40.7 million) in the state, according to reports.
WESTLAKE, OH – Nordson Corp. reported fiscal second quarter Advanced Technology Solutions sales were nearly $319 million, an increase of 9.7% year-over-year.
PEACHTREE CITY, GA – The PCEA Conferences Task Group today announced the technical program for PCB West 2022, featuring nearly 50 presentations and more than 110 hours of in-depth electronics engineering training.
LOUISVILLE, KY – Sypris Electronics reported first quarter revenue was $9 million, an increase of 32.4% year-over-year.
KUALA LUMPUR – Kobay Technology posted revenue rose 184.1% year-over-year and 7.8% sequentially to RM100.1 million (US$22.8 million) in the fiscal third quarter.
HONG KONG – VTech Holdings reported flat fiscal 2022 revenue of $2.37 billion. Higher sales in North America were insufficient to offset lower sales in Europe, Asia Pacific and other regions.
MILPITAS, CA — SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) won a $300,000 grant from the US Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the US.