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POST FALLS, ID -- Integrated Ideas & Technologies Inc. recently completed construction and moved into a 23,000 sq. ft. manufacturing facility. The new facility is expected to help the SMT stencil and metal fabrication provider achieve a 50% increase in production capabilities over the next two years.

“We were at maximum capacity in our previous facility and did not have the space for the new equipment required for advancement of our SMT stencil and Metal Fabrication divisions,” said Michael Ray, president and owner of IIT.

The new plant is located 8 miles west of the company's previous facility, in Coeur D’Alene.


ARLINGTON, VA -- Jedec and the ESD Association today announced an agreement to develop joint standards and publications for electrostatic discharge sensitivity testing. The trade groups' members will form a joint task force for the standardization work, which are intended to alleviate confusion among manufacturers and users.

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GRAY, TN -- EMS provider Industrial Electronics Services Inc. will break ground this month on a 40,000 sq. ft. building, the company's fourth building. 

The firm employs 67 workers and projects 2008 sales of $6.5 million, up 44%. It expects to hire up to 100 more workers over the next three years.

The company, which performs smaller runs of SMT products and various box-build and other services, recently was named a certified supplier by Siemens Medical Solutions
SAN FRANCISCO -- After strong shipment growth in 2008, PCs may be headed for a dip in 2009, a top Deutsche Bank analyst said today. The credit market and deteriorating macro outlook are the culprits, says Chris Whitmore.

"We expect a difficult PC environment in 2009. We estimate industry-wide PC unit growth of 6% year-over-year and flat revenue growth," Whitmore wrote in a research note today.
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KUALA LUMPUR, MALAYSIAUnisem Group has started volume shipment of packages using copper wirebonding technology.
 
Integrated Device Technology thin shrink small outline packages integrate Unisem’s copper wirebonds for a range of applications, including clock devices for desktops and notebook PCs.
 
“IDT recognizes the traction copper has gained as an interconnect material in semiconductor packaging. The clear advantages of copper – better performance and higher electrical test yields – helped convince us and our customers of the strategic benefits we would receive by using copper wire,” said Anne Katz, vice president of worldwide assembly and test for IDT.
 
By 2009, 30% of Unisem’s wirebonders will be set up for copper, the company says.
HANOVER, NH – A large customer of ACT Electronics has filed suit, alleging the struggling EMS firm is demanding $250,000 to release product and other gear the customer claims to have paid for. 
 
In a lawsuit filed last week in U.S. District Court, Hypertherm Inc. says ACT is attempting to “extort” the contested monies. The dispute is costing Hypertherm a reported $47,000 per day and has forced the company to cease production on one of its lines.

ACT is facing financial issues, according to the lawsuit and other parties reached by Circuits Assembly. In recent weeks, ACT has announced mass layoffs at its Hudson, MA, and Corinth, MI, facilities.

The original December 2007 deal established payables were due 30 days after the product's receipt. Hypertherm reportedly purchased $60,000 to $70,000 worth of product a week from ACT, according to the New Hampshire Business Review.

Last month, ACT reportedly claimed “financial difficulties" and demanded Hypertherm pay in advance for its product builds. The suit alleges Hypertherm prepaid for $44,000 worth of product, yet ACT demanded an additional $250,000 for future builds before it would deliver the boards.

In response, Hypertherm demanded ACT release the paid-for product, plus stencils, test fixtures and tooling worth a reported $100,000. ACT thus far has refused, according to the suit. Hyperthem seeks an injunction.

 
SANTA ANA, CA – The Americas lags the world in HDI production, according to a new presentation delivered by Matt Holzmann last week.

Speaking at the IPC HDI Technology Conference in Dallas, Holzmann, president of Christopher Associates, said high density interconnect substrates production was $202 million in the Americas in 2006, far behind Southeast Asia ($3.6 billion), Japan ($1.5 billion), and Europe ($352 million). While the compound average growth rate of HDI in the Americas will be 7% through 2011, it will remain a distant fourth regionally, Holzmann said, citing data from Prismark Partners.

HDI is used in a wide range of end-products, ranging from cellphones to PC peripherals, medical gear and even aerospace. Cellphones make up nearly 40% of HDI board use, followed by IC package substrates at roughly 35%. Those two segments will remain the largest consumers by far through 2011.

Of the 3,600 laser drills installed worldwide, only 150 are in North America, Holzmann said. That reluctance to invest is one reason more than 80% of current demand filled from overseas sources, Holzmann said.

MINNEAPOLIS – HEI reported fourth quarter sales of $11.8 million, up 133% over last year.

For the period ended Aug. 30, the company reported $473,000 in net profits, easily topping its previous earnings year-to-date. The company had a net loss of $723,000 in the year-ago quarter.

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ELKHART, IND – CTS Corp. will reduce headcount by about 60 positions as part of an operational restructuring, the company said. The company will also consolidate certain operations and to improve its cost structure. Read more ...
SHENZHEN -- Huawei, one of China's largest electronics OEMs, took its cellphone manufacturing group off the market, saying the world financial situation must first be resolved.

"Given the current global market conditions and prevailing economic uncertainty the interests of the company are best served by postponing the sale process," Huawei said in a press release.

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BANNOCKBURN, ILIPC has published a standard said to be the first for power conversion.
 
IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries, covers product attributes, including specifications and document requirements; design; qualification testing; and manufacturing conformance testing.
 
"With the release of IPC-9592, the power supply industry will have a standard that will facilitate communication between the customer and supplier at a level that is unprecedented in this industry," said Dr. Scott Strand, senior technical staff member, integrated technology delivery quality, IBM, in a press release.
 
“IPC-9592 harmonizes the requirements for design, qualification, and production test practices,” said Jerry Strunk, technical manager of qualification and compliance, Lineage Power. “Suppliers that adopt this standard will be better able to provide customers reliable products.”
 
The committee is now working on the first revision of the document. 
 
IPC members may request a free copy of IPC-9592 within 90 days of its publication.

TAIPEIDelta Electronics Inc. reported September consolidated sales revenues totaled NT $13.9 billion, up 11% year-over-year, and up 2% sequentially.
 
The component maker’s consolidated sales revenues year-to-date were NT $110.73 billion, up 17% compared to the same period between January and September last year.
 
The components business group represented 18% of sales, the company said in a release.
 
US $1 = Taiwan $32.36

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