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TEDDINGTON, UK – A new approach adopted by the National Physical Laboratory has led to the design and build of the NPL – IPTM (Interconnect Properties Test Machine), says Dr. Chris Hunt and his team.
It applies defined deformation under precision control to measure materials properties. The apparatus permits materials data to be obtained from solder samples that have volumes and geometries similar to those of real solder joints, and from joints loaded in shear, mirroring the practical situation in the field.
The instrument reportedly can accommodate various solder alloys and surface coatings, and permits direct microscopic examination during the test at temperatures between -55 to 125°C.
A four-point measurement system for resistance monitoring also has been embedded and found to correlate well with structural degradation recorded during fatigue testing of solders, says NPL. The resistance measurement is directly related to the development of a crack; resistance data can be used to predict crack growth rates. The results indicate lifetime can be measured using the load decrease and/or the resistance increase. Measuring these parameters directly, for different solders and conditions, and relating them to real assembly performance, will aid modeling of lifetime prediction for Pb-free solders, says the group.
Although the mechanical behavior of Pb-free joints is known to be different from that of conventional SnPb joints, there is a lack of data suitable for modeling purposes; the need to generate such data to evaluate likely Pb-free solder performance has assumed some urgency, according to NPL.
It applies defined deformation under precision control to measure materials properties. The apparatus permits materials data to be obtained from solder samples that have volumes and geometries similar to those of real solder joints, and from joints loaded in shear, mirroring the practical situation in the field.
The instrument reportedly can accommodate various solder alloys and surface coatings, and permits direct microscopic examination during the test at temperatures between -55 to 125°C.
A four-point measurement system for resistance monitoring also has been embedded and found to correlate well with structural degradation recorded during fatigue testing of solders, says NPL. The resistance measurement is directly related to the development of a crack; resistance data can be used to predict crack growth rates. The results indicate lifetime can be measured using the load decrease and/or the resistance increase. Measuring these parameters directly, for different solders and conditions, and relating them to real assembly performance, will aid modeling of lifetime prediction for Pb-free solders, says the group.
Although the mechanical behavior of Pb-free joints is known to be different from that of conventional SnPb joints, there is a lack of data suitable for modeling purposes; the need to generate such data to evaluate likely Pb-free solder performance has assumed some urgency, according to NPL.
ARMONK,
NY -- IBM's
systems revenue rose
2% in the first quarter versus a year ago,
providing some hope for the company's EMS suppliers.
Hardware revenue was down 7% year-over-year to $4.2 billion. Excluding printers and microelectronics, revenue was up 2% versus a year ago. Storage and System z (IBM's mainframe computing) segments were each up 10%.
HELSINKI -- Nokia posted strong first-quarter results, reporting revenues of €12.66 billion, up 28% year-over-year. Operating profit rose 20% to €1.53 billion.
CARLSBAD, CA -- Palomar Microelectronics has tripled the size of its cleanroom assembly space and increased its prototyping, applications engineering, process development, assembly, and test services capabilities.
The company, a unit of Palomar Technologies, opened 2,500 sq. f. class 100K and 500 sq. ft. class 10K cleanrooms, said to enable rapid prototyping and turnaround of advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.
“The new cleanroom space allows us to provide microelectronic services for many of the emerging technologies in areas such as MEMS, high bright LEDs, and other advanced packaging applications and to speed delivery of these services to our customers,” said Donald Beck, operations manager for Palomar Microelectronics.
The company, a unit of Palomar Technologies, opened 2,500 sq. f. class 100K and 500 sq. ft. class 10K cleanrooms, said to enable rapid prototyping and turnaround of advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.
“The new cleanroom space allows us to provide microelectronic services for many of the emerging technologies in areas such as MEMS, high bright LEDs, and other advanced packaging applications and to speed delivery of these services to our customers,” said Donald Beck, operations manager for Palomar Microelectronics.
STAMFORD, CT -- Worldwide semiconductor capital equipment spending will drop 19.8% to $47.5 billion this year, says Gartner Inc.
In December, the research firm forecast a 10% drop for the year.
Global packaging and assembly equipment spending is now forecast to drop 18.1%, extending last year's 3.7% decline. Automated test equipment is expected to drop 13% this year, following last year's 14% decline. Gartner said market conditions for those segments should begin to turn up this summer.
PHILADELPHIA – Confusion over whether to conformally coat assemblies has, with the increase in Pb-free processing, become a major discussion point, especially for producers of high reliability products.
On May 17, the American Competitiveness Institute will sponsor a free, five-hour seminar on different coating materials and application methods, and will examine the issue of contamination detection and control. Other topics of discussion will include tin whiskering. This is the first in a series of free workshops covering key manufacturing issues.
Presenting will be Graham Naisbitt, who has over 30 years’ experience in coatings, as a user and in application and test equipment. He is co-chairman of the IPC Test Methods subcommittee and SIR task group, and has received multiple IPC Distinguished Committee Service awards for efforts on IPC-CC-830 IPC-HDBK-830 (conformal coating), J-STD-004 (fluxes) IPC-TM-650 2.6.3.7 (SIR), IPC-9201A (SIR Test Handbook) and 2.6.25 (CAF Testing). He also works on IEC TC91 Standards Committee.
The presentations will include explanations of conformal coatings; how to apply , inspect and assess them; new coating technologies; contamination detection and control The event is suited to engineers, design, quality and inspection staff, production and test operators and any member of staff tasked with quality control.
To attend, contact Ken Friedman at 610-362-1200 x 279 or kfriedman@aciusa.org by May 12.
ACI is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for the Department of Defense and industry. The company operates the US Navy’s Center of Excellence in Electronics Manufacturing and is located directly next to the Philadelphia Airport.
On May 17, the American Competitiveness Institute will sponsor a free, five-hour seminar on different coating materials and application methods, and will examine the issue of contamination detection and control. Other topics of discussion will include tin whiskering. This is the first in a series of free workshops covering key manufacturing issues.
Presenting will be Graham Naisbitt, who has over 30 years’ experience in coatings, as a user and in application and test equipment. He is co-chairman of the IPC Test Methods subcommittee and SIR task group, and has received multiple IPC Distinguished Committee Service awards for efforts on IPC-CC-830 IPC-HDBK-830 (conformal coating), J-STD-004 (fluxes) IPC-TM-650 2.6.3.7 (SIR), IPC-9201A (SIR Test Handbook) and 2.6.25 (CAF Testing). He also works on IEC TC91 Standards Committee.
The presentations will include explanations of conformal coatings; how to apply , inspect and assess them; new coating technologies; contamination detection and control The event is suited to engineers, design, quality and inspection staff, production and test operators and any member of staff tasked with quality control.
To attend, contact Ken Friedman at 610-362-1200 x 279 or kfriedman@aciusa.org by May 12.
ACI is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for the Department of Defense and industry. The company operates the US Navy’s Center of Excellence in Electronics Manufacturing and is located directly next to the Philadelphia Airport.
SALT LAKE CITY – EMS provider CirTran Corp. reported revenue of $12.4 million for 2007, up 42% year-over-year during what its president and CEO Iehab J. Hawatmeh called “an investment year.”
CirTran’s gross profit was $3.2 million, down 3% compared to 2006, as a result of higher than expected cost of sales experienced in entering the online marketplace, along with lower margins on startup marketing services, the company said.
For the year, CirTran reported a net loss of $7.2 million, up from 2006’s loss of $2.9 million, which was attributed to increases in selling, general and administrative expenses.
SACRAMENTO, CA – A measure by the California Department of Toxic Substances Control to establish a new framework for chemicals management is drawing criticism from electronics industry trade groups.
LIVERMORE, CA – Livermore Lab announced plans to layoff up to 535 employees, including scientists and engineers. These involuntary layoffs could start as early as mid-May.
The state-funded lab laid off about 500 temporary and support employees in January, and 215 permanent employees took a buyout in March.
The shedding of employees is a result of increased costs associated with the changeover to private management from the University of California last fall, says the lab.
After the next set of layoffs, the lab will still employ about 6,600.
Manager Lawrence Livermore National Security anticipated about $80 million in increased costs; however, the costs have reached $280 million.
The state-funded lab laid off about 500 temporary and support employees in January, and 215 permanent employees took a buyout in March.
The shedding of employees is a result of increased costs associated with the changeover to private management from the University of California last fall, says the lab.
After the next set of layoffs, the lab will still employ about 6,600.
Manager Lawrence Livermore National Security anticipated about $80 million in increased costs; however, the costs have reached $280 million.
LONDON – Copper jumped more than 3% Wednesday, reversing a prior drop, as word leaked of a possible strike at Codelco, the world’s largest producer.
RICHARDSON, TX – TXP Corp. today reported a fourth quarter net loss of $5.8 million on sales of $2.8 million.
MILWAUKEE – Tyco Electronics will close its plant here and lay off 101 workers, the company said in a state filing.
In a required filing with the Wisconsin Department of Workforce Development, Tyco said it would lay off 58 full-time and 43 temporary employees.
The company is making moves to improve its competitiveness and cost structure.
A handful of affected employees will be offered relocation, the company said.
Press Releases
- KIC to Exhibit at Four SMTA Expo & Tech Forums in August
- Genie Electronics Leverages Cetec ERP for Superior Efficiency and Customer Service
- Automatic Nozzle Height Adjustment Reduces the Potential for Soldering Defects in Wave Soldering Processes
- BTU International Appoints E-Tronix as Its Representative in Six States