NOIDA, INDIA – Dixon Technologies is opening a third cellphone assembly plant in January, its 11th manufacturing facility overall.

GUJARAT, INDIA – The India Cellular and Electronics Association (ICEA) formed a capital goods committee to address technology gaps in the EMS and cellphone sectors in the country, according to reports. Foxconn India managing director Josh Foulger will head the committee.

MINNEAPOLIS – SMTA selected Sabrina M. Rosa-Ortiz as the recipient of the 2020 Joann Stromberg Student Leadership Scholarship.

ATLANTA, GA – OCTOBER 8, 2020 – In response to customer demand, PCB East returns to Boston for 2021 for the first time since 2009.

SON, THE NETHERLANDS – Neways Electronics said its chief operating officer Adrie van Bragt is leaving the company Dec. 31.

KWIDZYN, POLAND – Lacroix Electronics is adding 16,000 sq. m. to its factory here, according to reports. The existing plant is 14,000 sq. m. The firm says the extra space will be used for research and development and production.

NEW DELHI – India has approved federal incentives to boost domestic smartphone production to 16 companies, including iPhone makers Foxconn, Wistron and Pegatron, according to reports.

SAN ANTONIO – CEP Technologies is expanding its technical cleaning and tape-and-reel operations at its manufacturing facility here to support the EMI/RFI shielding market in the US and Mexico.

MILPITAS, CA – The first SEMI Global Smart Manufacturing Conference will gather Industry 4.0 experts Oct. 20-23 to share best known methods for improving data capture and analysis in microelectronics manufacturing.

ATLANTA – ECIA’s Global Industry Practices Committee will give updates on the latest component sales trends and Covid-related customer interaction during its third quarter update on Oct. 19.

BANNOCKBURN, IL – Total North American PCB orders sank in August, falling 24.9% year-over-year and 1.6% sequentially, according to IPC.

BANNOCKBURN, IL — IPC released IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.