MINNEAPOLIS – Illinois Tool Works has integrated three of its businesses: Speedline Technologies, Vitronics Soltec and Despatch Industries. This new division consolidates all of its Electronic Assembly Equipment and Thermal Processing Technology business and will operate under the name ITW EAE.

HAMPSHIRE, UK -- New research finds revenues from smart home hardware and services will reach $83 billion this year, rising to $195 billion by 2021.

MCLEAN, VA – Manufacturing technology orders declined 2.4% sequentially to $329.6 million in November, according to AMT – The Association for Manufacturing Technology. Year-to-date orders were down 5.1% to nearly $3.6 billion compared to the same period in 2015.

TAIPEI -- Advanced Semiconductor Engineering, the parent company of Universal Scientific Industrial, announced consolidated net revenues for December rose 20% from 2015 to $792 million.

TAIPEI -- Compal Electronics reported December's consolidated revenues fell 13.8% from 2015 to NT$71.7 billion ($2.23 billion).

TAIPEI -- Inventec reported consolidated December revenues of NT$38.5 billion ($1.2 billion), down 0.26% year-over-year.

WESTWOOD, MA – Chase Corp. reported revenue of $61.4 million for the quarter ended Nov. 30, up 7% year-over-year.

WESTLAKE, OH -- Nordson has acquired assets of ACE Production Technologies, a Spokane, WA-based designer and manufacturer of selective soldering systems.

STAMFORD, CT – Worldwide combined shipments of PCs, tablets, ultramobiles and mobile phones are projected to remain flat in 2017 compared to 2016, totaling 2.3 billion, says Gartner.

FRAMINGHAM, MA – Worldwide spending on Internet of Things (IoT) is forecast to reach $737 billion in 2016, as organizations invest in the hardware, software, services and connectivity that enable IoT, says International Data Corp. Global IoT spending will experience a CAGR of 15.6% from 2015 to 2020, reaching $1.29 trillion in 2020.

LOS ANGELES -- Ducommun today announced Stephen G. Oswald will join the company as president and chief executive effective Jan. 23.

BERLIN – iNEMI will host a webinar on fan-out wafer level packaging on Jan. 12.