SURREY, ENGLAND – TT Electronics said sales from continuing operations in the first nine months of 2010 grew 29% to $679.6 million.

The firm, which supplies components and electronics manufacturing services, expects higher volumes to continue through the end of the calendar year.

The company said improved business conditions continued in the quarter with good growth in most of its markets, including the automotive markets in Europe and Asia.

TT Electronics swung to a first-half profit in August.

TORONTO – Celestica Inc. reported third-quarter revenue of $1.55 billion, nearly flat with the same period of 2009.

GAAP net earnings were $35.4 million, compared to a GAAP net loss of $600,000 for the third quarter of 2009.

BANNOCKBURN, IL – The global EMS industry is returning to double-digit growth, says IPC.

NEENAH, WI – Plexus Corp. reported fourth-quarter revenue was $556 million, up 41% from a year ago and 3.6% sequentially on broad-based demand.

SINGAPORE – Flextronics International Ltd. reported GAAP net income of $144 million for the second quarter, up a staggering 620% year-over-year.

RENO, NV – Dr. Jeremy Smallwood, managing director of Electrostatic Solutions, received the Industry Pioneer Recognition Award at the EOS/ESD Symposium here.

The plaque recognized Dr. Smallwood’s “unselfish devotion to advancing the awareness of EOS/ESD throughout the world and for the significant contributions” he has made to the ESD Association.

David Swenson, past president and a director of the association, presented the award.

SPOKANE VALLEY, WA -- Key Tronic reported fiscal first-quarter net income rose to $1.7 million, up 467% from a $300,000 profit last year.

BANNOCKBURN, IL – North American printed circuit board shipments in September increased 18.5% year-over-year, as orders rose 2.5%, says IPC.

ANGLETON, TX – Benchmark Electronics reported third-quarter 2010 sales of $614 million, up 20% year-over-year.

STOCKHOLM – Contract manufacturer PartnerTech reported third-quarter net sales of SEK 482.1 million, up a slight 0.8% from the year-ago period.

The firm recorded an operating loss in the quarter of SEK 5.3 million, compared to income of SEK 500,000 in the same period in 2009.

NEVADA CITY, CA – In a recent New Venture Research report, the following areas of advanced IC packaging are discussed, including forecasts of units, pricing, and revenue: stacked IC packaging; through silicon vias; system in package; wafer level packages, including fan-out WLPs; staggered inner-row QFNs, and interconnection, including flip chip.

Advanced IC Packaging Technologies and Markets finds that stacked packages will grow from 2.6 billion in 2009 to 5.5 billion in 2014; SiPs will grow from 1.4 billion last year to nearly 3 billion in 2014; WLPs will grow from 6.8 billion in 2009 to 16.8 billion in 2014; fan out WLPs will expand from 2.9% of that last year to 6%; QFNs will grow from 10 billion to 22 billion in that time period, and staggered inner-row QFNs will expand from less than 1% to 6%.

Through silicon vias, while still a ways off in terms of implementation, have promise in a number of markets, including DRAMs, MPUs, PLDs, special purpose logic communications chips, CMOS image sensors, and graphics chips, says the firm. Flash is another potential market for this technology. TSVs and the market size potential are discussed in the report.

For more information, visit www.newventureresearch.com.

REDMOND, WA – Data I/O Corp. today reported third-quarter 2010 revenue of $6.6 million, up 24% year-over-year.