DOWNERS GROVE, IL – After a booming start to the year, Dover Corp. expects sales at its Electronic Technologies business unit to tail off through the second half.

BERLIN – The International Electronics Manufacturing Initiative is sponsoring a workshop here on the technical and regulatory challenges anticipated in the implantable and portable segments of the medical electronics industry.  

The event is scheduled for Sept. 16 and 17 and will focus on identifying the technology challenges and standardization gaps that can best be solved by collaborative efforts by the medical electronics industry.

Workshop discussions will cover research programs, regulatory requirements/processes, and technology deployment challenges.

The event will include speakers from Endicott Interconnect Technologies; IMEC; IZM; Med-el; Micro Systems Engineering; Reinhardt Microtech, and Sanmina-SCI.

For information and to register, visit http://www.inemi.org/cms/calendar/Medical_Pkg_Sept2010.html. 

CONKLIN, NY – The first Advanced Research in Electronics Assembly Consortium meeting of the year began with an update on the effects of print paste volume on drop test performance for 0.4 mm pitch CSPs.

The discussion migrated toward thermal characterizations, with a look at the reliability of thermal interface tapes, followed by in-depth studies of unique methods for enhancing the performance of filled polymeric thermal bond lines.

The thermal interface assembly “cookbook” was also reviewed at the event, hosted by Universal Instruments’ Advanced Process Lab.

A look at the overall robustness and reliability of electronics assemblies under conditions of overstress, thermal and isothermal cycling, long-term aging, and more complex loading histories included a focus on BGA and CSP assemblies, but emphasis was placed on configurations found to behave differently.

Presentations looked at pad cratering and an analysis of intermetallic failures on electrolytic NiAu; Pb-free solder microstructure and reliability, including detailed discussions on the thermal cycling of Pb-free BGAs, TSOPs, QFNs and solder joints; thermal cycling and why TSOPs, QFNs, LGAs, and passives are all different from BGAs in this regard; and a look at the reliability of reballed components and Pb-free solder joints on ENEPIG pads.

WASHINGTON – The National Association of Manufacturers contends the proposed Toxic Chemicals Safety Act bill hurts manufacturers’ ability to innovate and remain competitive.

“It dramatically expands the scope of the Environmental Protection Agency’s authority over every sector of our nation’s economy, sets unrealistic standards and timeframes, and puts unnecessary burdens on manufacturers with new and inconsistent statutory requirements,” vice president for energy and resources policy Keith McCoy said in a statement.

He said the bill will upset the tenuous relationship between manufacturers and regulators.

“Manufacturers support a US chemical regulatory and management system that is risk-based and uses the best science to ensure chemicals are safe for their intended use. We believe federal regulation should protect human health and the environment, promote innovation, restore public confidence, and avoid unnecessarily adverse economic impacts on small and large businesses.

“If enacted, this bill will create even more uncertainty for manufacturers and will hurt their ability to create jobs and grow our economy at a critical time in our nation. Manufacturers will continue to work with Congress to achieve meaningful reform of our chemical regulatory system, which is not overbearing and cumbersome to manufacturers.”

BUCKS, UK – Smart Group will soon launch its third Pb-free guide, featuring more than 25 pages of examples and causes of defects.

The new, color booklet covers wave, selective, reflow and manual soldering. It also features defects associated with conformal coating, PoP technology, cleaning, and land grid array components.

To download the current defect guide for free and be the first to receive the updated version, visit http://www.smartgroup.org/leadfreedefectsguide/.    
 

SAN JOSE -- Flextronics, the world's second-largest contract electronics manufacturer, said fiscal first-quarter net income was $118.2 million, up from a loss of $154 million last year.

TORONTO -- Celestica swung to a second-quarter GAAP net loss of $6.1 million, one year after earning $5.3 million.

DOWNERS GROVE, IL -- Dover Corp. today reported second-quarter earnings from continuing operations rose 70% year-over-year to $171.9 million.

BOSTON -- In light of a series of suicides at the Foxconn Electronics' campuses in China, a broad coalition of over 40 European, Australian and US investors have joined their voices to issue a public statement condemning abusive workplace conditions in the global electronics supply chain.

NEENAH, WI – Plexus today reported fiscal third-quarter revenue of $536 million, on broad-based end-market demand. The contract electronics manufacturer said it would bring an additional manufacturing facility online in Penang, Malaysia, in early fiscal 2012.

WASHINGTON – Included in the financial sector reform law President Obama signed this week was legislation designed to prevent trade in so-called conflict minerals from the Democratic Republic of the Congo.

BANNOCKBURN, IL – IPC has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard.

The revision provides industry consensus guidance on requirements of land pattern geometries, as well as surface mount design recommendations for achieving the best solder joints.