Latest News
BANNOCKBURN, IL – North American PWB shipments in August decreased 26.5% compared to the year prior, while orders dropped 11.7%.
Year to date, shipments were down 27%, and orders declined 25.7%. Sequentially, shipments increased 4.5%, and orders rose 13.1%.
The book-to-bill ratio held steady at 1.07, says IPC.
August rigid PWB shipments dropped 27.4%, and orders were down 13% year-over-year. Year to date, rigid shipments were down 28.7%, while orders fell 26.9%. Sequentially, rigid shipments grew 4.8%, and orders increased 12.2%. The rigid book-to-bill ratio remained above parity at 1.09.
Flex shipments dropped 13.7% for the month, while orders rose 7.5% compared to the same month last year. Year to date, flex shipments were down 2.7%, and orders dropped 7.3%. Sequentially, flex shipments increased 2.1%, and orders were up 26.5%.
The flex book-to-bill in August fell to 0.92, says the association.
“It’s slow going, but we’re seeing more signs of recovery in the North American PCB industry,” said IPC president Denny McGuirk. “Rigid PCB bookings are strengthening, and that is keeping the book-to-bill ratio well above parity. It has been positive now for four consecutive months, which suggests that we should start to see the impact in sales growth this fall.”
Rigid PWBs represent an estimated 91% of the current industry in North America, says to IPC. In August, 87% of total shipments reported were domestically produced.
Domestic production accounted for 88% of rigid and 82% of flex shipments for the month.
KENOSHA, WI – Promation Inc. has relocated its North American headquarters here: 9522 58th Place, Kenosha, WI, 53144.
The facility includes a larger office space, an expanded equipment showroom area, a process testing/evaluation area, and warehouse facilities.
Promation provides PCB handling equipment, robotic soldering systems, automated label placement, and other custom automation.
LYON, FRANCE -- Wafer-level-package use will exceed 10 billion units per year by 2012, a compound annual growth rate of more than 20% over the next five years.
SMYRNA, GA – Registration is now open for PCB Atlanta, the industry’s leading regional PCB show in the Southeastern US.
PCB Atlanta will be held Oct. 22 at the Atlanta Marriott Alpharetta, in Alpharetta, GA.
The conference includes a two-track technical program featuring speakers from Plexus, Circuit Connect, Endicott Interconnect Technologies, Clover Electronics, Intercept Technology and others.
Topics include circuit board design to fabrication to assembly, and cover such subjects as counterfeit components, design reuse, cleaning flux residues under the z-axis, and vertical integration strategies.
PCB Atlanta exhibits will be open from 11 am - 6 pm. Free technical sessions will be held beginning at 9 am.
For more information, visit www.pcbshows.com/atlanta.
HARTFORD, CT – Connecticut has proposed state regulations on e-waste recycling that would require manufacturers to fund the pickup and recycling of goods. Electronics manufacturers are unethusiastic, however, and reportedly would favor a federal solution.
According to published reports, the bill calls for electronics manufacturers to pay the costs of recycling their products, while the state would select the haulers.
Manufacturers would be financially responsible only for the transport and recycling of computers, monitors, TVs and printers, and only materials from residences.
The clause excluding manufacturers from controlling the volume and flow of material, as well as the state’s selection of haulers, has prompted the Consumer Electronics Association to voice concerns about the possibility of excessive fees.
Similar legislation is already in effect in six states, including California and Maine.
ELKHART, IN -- Thales has signed a three-to-five year, $5 million deal with CTS Corp.'s electronics manufacturing solutions business to design and manufacture assemblies.
BANNOCKBURN, IL – IPC presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at its trade show this week.
SAN FRANCISCO – The combination of firming global IT demand, the release of Windows 7 and an aging PC installed base will drive a strong multiyear PC replacement cycle, says a leading analyst.
Deutsche Bank Equity Research today raised its 2009 PC unit outlook from a drop of 8% year-over-year to a drop of 2%. For 2010, the firm now expects PC units to rise 10% year-over-year, up from a prior estimate calling for a flat year.
LONDON – The global economic downturn had a marked effect on the tantalum supply/demand balance. Demand in 2009 will probably prove to be 40% down on 2008, but some market watchers believe it will fully recover by 2012.
Whether the supply will be in place to meet that demand is another issue entirely.
In mid 2008, tantalum consumption was on a strong growth trend in its principal markets – electronics and aerospace superalloys – which make up around 75% of tantalum consumption. Adequate primary supply was in place, along with substantial quantities of scrap, which is mostly generated during capacitor manufacture.
By the second half of 2009, the tantalum market faces a period of uncertainty that will, quite possibly, remain until 2012, according to Roskill Information Services.
A large part of the primary supply chain is not producing in 2009, with no clear indication about when, or if, it will come back to the market. Inventories are running down; scrap is in shorter supply because of a fall in capacitor manufacture. It is possible legislation under consideration in the US could severely restrict or even halt the supply of tantalum from Central Africa, says Roskill.
Several projects are at various stages of development around the world and some could be in production by 2011 or 2012. Combined, their output would solve the tantalum supply question for the foreseeable future and obviate the need to source conflict minerals.
It is almost certain a tantalum supply squeeze is approaching. If demand picks up more quickly than expected, a spike in spot prices seems inevitable, says the firm.
CLINTON, NY – Indium Corp. has acquired the processes, equipment, and know-how of Reactive NanoTechnologies Inc., developer and manufacturer of NanoFoil.
Indium will move the RNT process and equipment, and a core staff, to its Utica, NY facility.
Customers will now place orders and inquiries directly through Indium. The core RNT team and Indium personnel will support NanoFoil and NanoBond businesses.
No financial terms of the agreement were disclosed.
ATLANTA – Siemens Electronics Assembly Systems has moved to an expanded complex north of Atlanta. The move was finalized in July.
The facility, located in Suwanee, GA, is now fully operational.
