FOUNTAIN INN, SC – Kyocera AVX has unveiled its new KGP Series commercial-grade stacked multilayer ceramic capacitors (MLCCs), engineered to deliver higher capacitance values in a compact footprint for high-frequency applications. Designed to support miniaturization and sustainability trends, the series eliminates lead and cadmium, ensuring compliance with environmental standards while maintaining low ESR and ESL to minimize noise and optimize performance.

GURUGRAM, INDIA – VVDN Technologies is preparing for an Initial Public Offering once its annualized revenue reaches $1 billion, according to cofounder Vivek Bansal. The Gurugram-based design-led electronics manufacturer is expanding its global footprint with new production facilities in the UAE and the US to navigate tariffs and meet local sourcing demands.

Elgin, IL – 9/22/2025 – Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc. This strategic acquisition enhances Precision PCB's capabilities in assembly, strengthens its technical expertise, and expands the value delivered to customers.

NEEDHAM, MA – Global PC shipments accelerated in the third quarter, rising 9.4% compared to the same period a year earlier, according to preliminary data from International Data Corporation. The total of 75.8 million units reflects a steady refresh of aging hardware as Windows 11 adoption continues to shape replacement cycles.

PHOENIX – Global investment in 300mm fab equipment is set to total $374 billion from 2026 to 2028, according to SEMI’s latest 300mm Fab Outlook. The ramp is fueled by AI chip demand for data centers and edge devices, along with policy-backed regionalization and supply-chain restructuring aimed at greater self-sufficiency. SEMI expects this year to be the first year 300mm spending tops $100 billion, rising 7% to $107 billion, with further gains to $116 billion in 2026, $120 billion in 2027, and a jump to $138 billion in 2028.

NEWCASTLE-UNDER-LYME, UK – Incap Corporation has completed the installation of a rooftop solar power system at its manufacturing facility, a move aimed at increasing the site’s share of renewable energy. The new system is expected to provide nearly half of the factory’s daytime electricity demand and about one-third of total annual consumption, supporting the company’s broader environmental goals while reducing energy costs.

WASHINGTON – Global semiconductor sales reached 64.9 billion dollars in August, up 21.7% from 53.3 billion dollars a year earlier, according to the Semiconductor Industry Association. Sales also increased 4.4% sequentially from 62.1 billion dollars in July.

BIÑAN, PHILIPPINES – Integrated Micro-Electronics, Inc. (IMI) has completed the consolidation of its Kuichong operations into its Pingshan facility in Shenzhen, China, a strategic move designed to streamline its manufacturing footprint, improve operational efficiency and increase capacity utilization.

SAINT-HERBLAIN, FRANCE – Lacroix reported first-half 2025 revenue of about $30.1 billion, reflecting an 11.9% year-over-year decline on a comparable basis, as the company continued its strategic withdrawal from low-margin contracts and prepared to exit the North American electronics market. The Environment segment remained a bright spot, growing 9% and delivering a current EBITDA margin of 23.4%. Group EBITDA stood at roughly $2.2 billion, representing a margin of 7.5%.

BANNOCKBURN, IL -- North American electronics manufacturing services companies reported shipments in July fell 4.1% compared to 2024.

BANNOCKBURN, IL -- North American printed circuit board manufacturers reported July shipments rose 20.7% from last year.

PEACHTREE CITY, GA – OCTOBER 1, 2025 – The Printed Circuit Engineering Association (PCEA) today announced Mike Buetow as the first individual awarded the PCEA Lifetime Achievement Award and as the first inductee in the newly established PCEA Hall of Fame. The announcement was made at the PCEA annual meeting in conjunction with the PCB West conference and exhibition.