News
MUNICH – Siemens Electronics Assembly Systems became operational Jan. 1 as a legally separate company within the Siemens technology conglomerate.
This step signaled the end of the so-called “carve-out process,” begun in 2008, the firm reports. The new company handles the Siplace placement machines and related assembly equipment lines.
In addition, the company’s restructuring program is entering a second phase. Plans call for further streamlining of the company’s global processes, and consolidation of its development and manufacturing capacities. The firm did not provide further details.
This step signaled the end of the so-called “carve-out process,” begun in 2008, the firm reports. The new company handles the Siplace placement machines and related assembly equipment lines.
In addition, the company’s restructuring program is entering a second phase. Plans call for further streamlining of the company’s global processes, and consolidation of its development and manufacturing capacities. The firm did not provide further details.
TOKYO -- Panasonic Corp. will cut 560 jobs and close two plants in Asia, the company said today.
The sites set for closure are in Malaysia and the Philippines. About 500 workers will be laid off in Malaysia, and 60 more in the Philippines.
The sites set for closure are in Malaysia and the Philippines. About 500 workers will be laid off in Malaysia, and 60 more in the Philippines.
PEMBROKE, BERMUDA -- Tyco Electronics reported first-quarter sales dropped 21% from a year ago, and the GAAP operating loss swung to a loss on lower demand and poorer margins.
EINDHOVEN, NETHERLANDS -- Royal Philips
Electronics swung to a fourth-quarter loss of $1.9 billion
and sales fell 9% to $10.1 billion in the quarter.
RICHARDSON, TX – Elcoteq will lay off 96 workers including all its employees in engineering services here, according to reports.
The layoffs will take place between late March 24 and early April 7.
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council has finalized the program for its first-quarter symposium, Semiconductor Packaging – Impacting the Age of Consumer Electronics.
The event will be held Feb. 19 in San Jose.
Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, will keynote the symposium, discussing the consumer electronics boom – how semiconductor and consumer electronics companies can improve cost, time-to-market and product quality.
Other presentation topics include time-to-market and consumer semiconductor packaging; signal integrity: getting it right the first time; modeling package thermal behavior in advanced process technologies; time-to-market is everything; cost-of-ownership challenges for consumer products; a fabless semiconductor's point of view: IC package technology development and the total cost of ownership; an OSAT provider's point of view for consumer applications: IC package development and total cost of ownership challenges; solutions for consumer product miniaturization; STATSChipPAC – evolution of package on package; selecting the right packaging technology: finding the optimum balance between device and system level considerations in consumer applications; trends in low profile packaging; advancing technologies for consumer electronics; new tornado: adoption of MEMS processes by IC industry; microbatteries for integrated autonomous microdevices; the future of MEMS chem-bio sensors, and mobile projection displays based on biaxial scanning MEMS mirrors.
The event will be held Feb. 19 in San Jose.
Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, will keynote the symposium, discussing the consumer electronics boom – how semiconductor and consumer electronics companies can improve cost, time-to-market and product quality.
Other presentation topics include time-to-market and consumer semiconductor packaging; signal integrity: getting it right the first time; modeling package thermal behavior in advanced process technologies; time-to-market is everything; cost-of-ownership challenges for consumer products; a fabless semiconductor's point of view: IC package technology development and the total cost of ownership; an OSAT provider's point of view for consumer applications: IC package development and total cost of ownership challenges; solutions for consumer product miniaturization; STATSChipPAC – evolution of package on package; selecting the right packaging technology: finding the optimum balance between device and system level considerations in consumer applications; trends in low profile packaging; advancing technologies for consumer electronics; new tornado: adoption of MEMS processes by IC industry; microbatteries for integrated autonomous microdevices; the future of MEMS chem-bio sensors, and mobile projection displays based on biaxial scanning MEMS mirrors.
NEW YORK – Dover reported fourth-quarter revenue of $1.7 billion, down 8% from last year, and net earnings from continuing operations of $170 million, down 3%.
TOKYO – The consolidation of Japan’s electronics industry is a must to stay viable, says former Sony Corp. chairman Nobuyuki Idei.
CHELMSFORD, ENGLAND – A 10-page photographic reference guide on counterfeit components is available from Bob Willis.
SANTA CLARA, CA – Intel chairman Craig Barrett will retire from active management in May at the company’s annual stockholders' meeting, the company said today.
HAVERHILL, MA – Engineering firm DKN Research and NY Industries, a circuit board manufacturer, launched a prototype and engineering service for printable electronics.
The firms established a prototype service for trials with new printable electronics products, using printing equipment and other circuit manufacturing facilities, including roll-to-roll systems with broad ranges of thick-film circuit technologies.
Ohtsu, Japan-based NY Industries is currently capable with a thick-film printing process for broad ranges of substrate materials for both rigid and flexible circuits; fine line traces down to 30 µm line and space; high conductivity thin thick-film traces down to 3 µm; single-side circuits, double-side circuits and multilayer up to eight layers; printed via holes with mechanically drilled holes and printed holes; solderable thick-film circuits; embedded resistors from 100 ohms to 10 megaohms; embedded capacitances up to 10,000 picofarads; embedded inductances with various constructions, and embedded EL devices with inorganic materials.
NEW YORK – IBM’s cautious outlook for server and storage hardware suggests lower revenue for its EMS suppliers, including Celestica, Sanmina, Flextronics, Jabil and Benchmark, Deutsche Bank said.
