News
ST. PETERSBURG, FL — Jabil Circuit's Italian subsidiary will acquire the manufacturing operations of Nokia Siemens Networks Italy in Cassina de’ Pecchi and Marcianise in a deal expected to close Nov. 1. European Union antitrust authorities have signed off on the deal, which will also include a long-term manufacturing agreement.
SHANGHAI — The International Electronics Manufacturing Initiative announced the opening of an office in Pudong, outside Shanghai.
iNEMI has named Haley Fu, Ph.D., as manager of operations-China to coordinate the consortium’s activities in the region.
The Shanghai office is the first iNEMI office outside of North America.
As manager of operations in China, Fu will be responsible for coordinating iNEMI activities in the region. She has several years’ experience in the electronics industry, working in areas such as environmentally preferred product development, surface-mounting technology, lead-free soldering and supply chain cost reduction.
iNEMI is planning an opening event for Jan. 16.
iNEMI has named Haley Fu, Ph.D., as manager of operations-China to coordinate the consortium’s activities in the region.
The Shanghai office is the first iNEMI office outside of North America.
As manager of operations in China, Fu will be responsible for coordinating iNEMI activities in the region. She has several years’ experience in the electronics industry, working in areas such as environmentally preferred product development, surface-mounting technology, lead-free soldering and supply chain cost reduction.
iNEMI is planning an opening event for Jan. 16.
BANGALORE, INDIA – EMS provider Elcoteq SE will build Telsima’s WiMAX-based broadband wireless access and DCME voice compression gear under a deal announced today. Volumes and financial details were not announced.
Elcoteq has begun volume manufacturing of Telsima’s WiMAX CPEs StarMAX 2100 series in Bangalore.
Elcoteq provides boxbuild manufacturing for WiMAX CPEs, including new product introduction, sourcing, manufacturing, logistics and after-sales services.
Elcoteq provides boxbuild manufacturing for WiMAX CPEs, including new product introduction, sourcing, manufacturing, logistics and after-sales services.
LIANYUNGANG, CHINA – Henkel Huawei Electronics Co., a joint venture of Huawei Electronics and Henkel Corp., announced plans to unveil its state-of-the-art mold compound manufacturing facility in Lianyungang, China on Oct. 26.
The operation will encompass 16,000 sq. meters of administrative and manufacturing space and reportedly will have a production capacity of 25,000 tons of material annually.
The site will be a central manufacturing hub, at which more than 10 patented epoxy mold compounds will be made, and will host product development, material prototype production, test and analysis and ongoing technology research.
The JV’s mold compound materials are currently incorporated into discrete components, SOICs, QFPs, BGAs, CSPs and POPs.
The operation will encompass 16,000 sq. meters of administrative and manufacturing space and reportedly will have a production capacity of 25,000 tons of material annually.
The site will be a central manufacturing hub, at which more than 10 patented epoxy mold compounds will be made, and will host product development, material prototype production, test and analysis and ongoing technology research.
The JV’s mold compound materials are currently incorporated into discrete components, SOICs, QFPs, BGAs, CSPs and POPs.
NASHUA, NH – NSAI announced the launch of its RoHS Compliance Assurance System certificate program, developed for organizations to demonstrate compliance to the E.U. RoHS directive enforcement guidance.
Upon successful completion of the assessment process, clients are issued a Certificate of Compliance to use to market and promote their manufacturing process.
“The organization does not necessarily have to be ISO-certified to benefit from this certification program,” said vice president Chris Morrell.
For information, visit www.nsaiinc.com/services/RoHS/.
Upon successful completion of the assessment process, clients are issued a Certificate of Compliance to use to market and promote their manufacturing process.
“The organization does not necessarily have to be ISO-certified to benefit from this certification program,” said vice president Chris Morrell.
For information, visit www.nsaiinc.com/services/RoHS/.
ORLANDO – SMTA is seeking abstracts for the 2008 SMTAI technical conference. Short course descriptions are also being solicited.
The abstract deadline is Jan. 7. Papers will be accepted March 7, and manuscripts are due May 26.
SMTA International will take place at Disney’s Coronado Springs Resort and Convention Center in Orlando, Aug. 17-21.
Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Material should be original, unpublished and non-commercial in nature. Papers are being solicited in the following categories: emerging technologies, components, assembly, PCB technology, process control and business.
Please submit abstracts at www.smta.org/smtai/call_for_papers.cfm.
EL SEGUNDO, CA – Global third-quarter large-sized LCD panel revenue is expected to increase by more than 17% sequentially and 45% year-over-year, iSuppli Corp. believes.
“iSuppli estimates that revenue rose to $16.7 billion in the second quarter, up from $13.4 billion in the first,” said Sweta Dash, director, LCD and projection research for iSuppli. “Despite an anticipated softening in demand growth in the fourth quarter, with the strong third-quarter results we expect large-sized LCD panel revenue for all of 2007 to rise by more than 27%” year-over-year.
As for shipments, the large-sized LCD market is expected to reach 370 million units by the end of the year.
“iSuppli expects 20% unit growth for monitor panels, 35% growth for notebook panels and 51% growth for the TV panel market in 2007 compared to 2006,” Dash said.
LG.Philips LCD started the earnings season off impressively, announcing an 18% increase in revenue sequentially and a 43% rise year-over-year, says the firm.
Samsung followed with an equally impressive 20% increase in LCD revenue compared to the second quarter, and a 34% increase compared to the third quarter last year.
Suppliers of large-sized panels fell short of demand in the quarter as a result of customers placing orders for the holiday season earlier than usual. Other factors behind the shortage included cuts in panel suppliers’ fab utilization rates in the first half, slowed production expansion plans and greater capital-spending discipline among LCD makers, according to iSuppli.
Suppliers of desktop-computer monitor, notebook and 32" and smaller TV panels remained constrained throughout the quarter, spurring significant price increases.
Most mainstream notebook and monitor panel prices increased by 7 to 10% from June to September, after a 10 to 15% price increase from the previous three months. The average 32" and below TV panel price rose by only 2 to 3% from June to September after a 4 to 5% price increase from April to June, according to iSuppli.
The 40/42" TV panel price decreased by less than 5% from June to September, the firm says.
Profitability among the large-sized LCD suppliers was better in the third quarter than the second. Monitor panels were particularly profitable.
TV panel profitability lagged behind the notebook and monitor panels in the quarter. This resulted in a partial shift in production capacity from TV panels – especially the 32" size – to monitor panels.
The phenomenon contributed to the supply tightness, resulting in panel price increases and higher profitability compared to the prior quarter. The 32" and 40/42" WXGA TV panels generated a 5 to 15% profit margin in the quarter.
The LCD-TV market is shifting to larger sizes because of the increased availability of bigger panels at lower prices. Furthermore, the move to thin form-factor and wide-format LCD display technology means consumers can more easily fit televisions with larger screen sizes into their homes. This trend, combined with HD resolutions, means such large-screen sets are practical for more consumers.
This shift to larger-sized panels will boost revenue and profitability for the TV panel makers. The monitor panel market also is shifting to the 19", 20" and 22" sizes.
The global LCD-TV panel market in 2008 is expected to expand to 102.5 million units, up 27.2% from 2007. This will mark the first time shipments will surpass the 100 million mark, says iSuppli.
“iSuppli estimates that revenue rose to $16.7 billion in the second quarter, up from $13.4 billion in the first,” said Sweta Dash, director, LCD and projection research for iSuppli. “Despite an anticipated softening in demand growth in the fourth quarter, with the strong third-quarter results we expect large-sized LCD panel revenue for all of 2007 to rise by more than 27%” year-over-year.
As for shipments, the large-sized LCD market is expected to reach 370 million units by the end of the year.
“iSuppli expects 20% unit growth for monitor panels, 35% growth for notebook panels and 51% growth for the TV panel market in 2007 compared to 2006,” Dash said.
LG.Philips LCD started the earnings season off impressively, announcing an 18% increase in revenue sequentially and a 43% rise year-over-year, says the firm.
Samsung followed with an equally impressive 20% increase in LCD revenue compared to the second quarter, and a 34% increase compared to the third quarter last year.
Suppliers of large-sized panels fell short of demand in the quarter as a result of customers placing orders for the holiday season earlier than usual. Other factors behind the shortage included cuts in panel suppliers’ fab utilization rates in the first half, slowed production expansion plans and greater capital-spending discipline among LCD makers, according to iSuppli.
Suppliers of desktop-computer monitor, notebook and 32" and smaller TV panels remained constrained throughout the quarter, spurring significant price increases.
Most mainstream notebook and monitor panel prices increased by 7 to 10% from June to September, after a 10 to 15% price increase from the previous three months. The average 32" and below TV panel price rose by only 2 to 3% from June to September after a 4 to 5% price increase from April to June, according to iSuppli.
The 40/42" TV panel price decreased by less than 5% from June to September, the firm says.
Profitability among the large-sized LCD suppliers was better in the third quarter than the second. Monitor panels were particularly profitable.
TV panel profitability lagged behind the notebook and monitor panels in the quarter. This resulted in a partial shift in production capacity from TV panels – especially the 32" size – to monitor panels.
The phenomenon contributed to the supply tightness, resulting in panel price increases and higher profitability compared to the prior quarter. The 32" and 40/42" WXGA TV panels generated a 5 to 15% profit margin in the quarter.
The LCD-TV market is shifting to larger sizes because of the increased availability of bigger panels at lower prices. Furthermore, the move to thin form-factor and wide-format LCD display technology means consumers can more easily fit televisions with larger screen sizes into their homes. This trend, combined with HD resolutions, means such large-screen sets are practical for more consumers.
This shift to larger-sized panels will boost revenue and profitability for the TV panel makers. The monitor panel market also is shifting to the 19", 20" and 22" sizes.
The global LCD-TV panel market in 2008 is expected to expand to 102.5 million units, up 27.2% from 2007. This will mark the first time shipments will surpass the 100 million mark, says iSuppli.
FRAMINGHAM, MA – Worldwide PC shipments grew by 15.5% in the third quarter, according to IDC.
SAN JOSE, CA – Jan Vardaman, president of TechSearch International Inc., will keynote the annual MicroElectronics Packaging and Test Engineering Council technical symposium in San Jose on Nov. 8.
In her keynote presentation, Markets and Trends in Laminate Substrates, Vardaman will present findings of the SEMI/TechSearch International Global Semiconductor Packaging Materials Outlook and provide insight into trends driving substrate developments, trends in feature size, and materials, including production capacity considerations and pricing trends.
Vardaman is the founder of TechSearch International, and the coauthor of How to Make IC Packages (published in Japanese), a columnist with Circuits Assembly, and author of numerous publications on emerging trends in semiconductor packaging and assembly.
In addition to the keynote presentation, the program has been segmented into the following focus sessions: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
To register, visit www.meptec.org.
In her keynote presentation, Markets and Trends in Laminate Substrates, Vardaman will present findings of the SEMI/TechSearch International Global Semiconductor Packaging Materials Outlook and provide insight into trends driving substrate developments, trends in feature size, and materials, including production capacity considerations and pricing trends.
Vardaman is the founder of TechSearch International, and the coauthor of How to Make IC Packages (published in Japanese), a columnist with Circuits Assembly, and author of numerous publications on emerging trends in semiconductor packaging and assembly.
In addition to the keynote presentation, the program has been segmented into the following focus sessions: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
To register, visit www.meptec.org.
EL SEGUNDO, CA – To say that Japanese OEMs have been shy about using contract manufacturing services could be the understatement of the year, says iSuppli Corp.
WELLESLEY, MA – The world market for mobile telematics was worth some $37.5 billion in 2006, a figure expected to reach $52 billion in 2012, a CAGR of 3.5% over the next five years, according to BCC Research.
The market includes applications of automotive, intelligent transportation systems (road installations and operations centers), aircraft, railroads, construction, agriculture and maritime technologies. Of these sectors, automotive accounts for the largest share of the market and is expected to reach more than $48 billion in 2012, at a 3.6% CAGR, says BCC. Growth in automotive telematics will be driven by government-mandated use of safety equipment.
Intelligent transport systems (road installations) currently have the second largest share of the market at $649 million, projected to reach more than $1.8 billion by 2012, a CAGR of 17.9%, according to BCC. However, intelligent transport systems (operations centers), now worth $375 million, will be worth $2 billion by 2012, a CAGR of 31.7%. The increasing sale of public roadways to private owners will speed the introduction of intelligent transport systems, with a corresponding rise in the need for mobile telematics components.
The market includes applications of automotive, intelligent transportation systems (road installations and operations centers), aircraft, railroads, construction, agriculture and maritime technologies. Of these sectors, automotive accounts for the largest share of the market and is expected to reach more than $48 billion in 2012, at a 3.6% CAGR, says BCC. Growth in automotive telematics will be driven by government-mandated use of safety equipment.
Intelligent transport systems (road installations) currently have the second largest share of the market at $649 million, projected to reach more than $1.8 billion by 2012, a CAGR of 17.9%, according to BCC. However, intelligent transport systems (operations centers), now worth $375 million, will be worth $2 billion by 2012, a CAGR of 31.7%. The increasing sale of public roadways to private owners will speed the introduction of intelligent transport systems, with a corresponding rise in the need for mobile telematics components.
LEUVEN, BELGIUM – IMEC and the Microsystems Packaging Research Center at the Georgia Institute of Technology invite interested parties to join a research program on next-generation flip-chip and substrate technology. The program addresses key IC-to-package to board packaging interconnect issues for 32 nm ICs and beyond.
IMEC and Georgia Tech will explore, develop and invent solutions to interconnect high-density ICs with tight I/O pitches (20-40 µm peripheral) to low-cost packages and PCBs. The program targets novel packaging approaches to reduce the mechanical stress on the IC after packaging and assembly.
The program plans to provide solutions for the four major barriers to next-generation flip-chip packaging of scaled ICs and ultra-low-k dielectric ICs. Its aim is to explore and develop organic package interposer substrates that minimize stress at die and package level and enhance the wiring density, the fine I/O pitch routing capability and the high-frequency signal performance of substrates; a new generation of fine-pitch flip-chip UBM (under-bump metallization) and barrier metallization that meet the electromigration and thermo-mechanical reliability targets of flip-chip scaling; novel solder and non-solder interconnect approaches, including advanced underfill materials and processes to meet future current density, geometry and reliability requirements; thermo-mechanical modeling, design and verification for improved reliability.
The two-year program is open for the entire supply chain. The program plans to bring together 20 to 30 expert researchers from industry and academia worldwide.
IMEC and Georgia Tech will explore, develop and invent solutions to interconnect high-density ICs with tight I/O pitches (20-40 µm peripheral) to low-cost packages and PCBs. The program targets novel packaging approaches to reduce the mechanical stress on the IC after packaging and assembly.
The program plans to provide solutions for the four major barriers to next-generation flip-chip packaging of scaled ICs and ultra-low-k dielectric ICs. Its aim is to explore and develop organic package interposer substrates that minimize stress at die and package level and enhance the wiring density, the fine I/O pitch routing capability and the high-frequency signal performance of substrates; a new generation of fine-pitch flip-chip UBM (under-bump metallization) and barrier metallization that meet the electromigration and thermo-mechanical reliability targets of flip-chip scaling; novel solder and non-solder interconnect approaches, including advanced underfill materials and processes to meet future current density, geometry and reliability requirements; thermo-mechanical modeling, design and verification for improved reliability.
The two-year program is open for the entire supply chain. The program plans to bring together 20 to 30 expert researchers from industry and academia worldwide.
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