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WASHINGTON, DC – Comments via the TBT process on Norway's Prohibition on Certain Hazardous Substances in Consumer Products regulation, known as “PoHS,” are due Aug. 10.

MANASSAS, VA – Zestron America recently completed a series of experimental tests confirming Vigon SC 200 to be fully compatible with organic solderability preservative misprinted board cleaning, the company reports.

The testing was conducted at Zestron’s technical center using a variety of lead and lead-free materials from solder paste manufacturers.

The experiments were conducted in ultrasonic and spray-in-air equipment. Variation in spray pressure ranging from 30 to 50 psi and ultrasonic frequency ranging from 10 to 20 watts per liter were considered, says Zestron.

The MPC technology-based cleaning agent was deliberately tested at 122°F to examine the worst-case scenario. Each misprinted board wash process was followed by two minutes of DI-water rinse and drying with hot circulated air for 15 minutes.

Excellent compatibility testing with OSP misprinted board cleaning was achieved at a maximum exposure time ranging from two to four minutes, depending on the solder paste formulation, the company says.

TORONTO – EMS provider SMTC Corp. reported revenue of $66.1 million for the second quarter, an increase of 8% year-over-year.

HAVERHILL, MA – Engineering firm DKN Research has developed the film base connector, the construction of which is built on a thin plastic film. It was developed for use as a high-density termination technology for flexible circuits, the company reports.

Micro bump arrays and soldering pads are built on thin heat-resistant film in this connector. The connectors are soldered on SMT boards, and flexible circuits with size hole arrays are placed on the connectors. The micro bump arrays make reliable connections to the flexible circuits, says DKN.

The connection spaces with a film base connector will be one order smaller compared to traditional connectors, the company adds. The heights of the connections can be smaller than 0.3 mm, including flexible circuits. A 6 x 10 array connector makes 60 reliable connections for finer flexible circuits than 100-µm pitches, and consumes 24 sq. millimeters for the 60 pin connections on the boards, DKN states.

Film base connectors are produced through a photolithography process. A design for the connectors will realize a high-density connection for 50-µm pitch flexible circuits in a small space, the company says.

A 1000-pin count connection in 10-mm square reportedly could be practical. Another big advantage for this connector device is repeated connections can be made where they cannot be made using other high-density termination technologies such as wire bonding and ACF connection, the company says.

DKN expect more capabilities from the termination technology because of the broad freedom of its construction. Exchangeable MCM packages, replaceable, stacked IC packages, and multi-layer rigid/flex are future goals for the company.

DKN has prepared a basic design guide explaining how to use the film base connectors with high-density flexible circuits. For more information, visit http://www.dknresearch.com/0707NewsFilmConEng.pdf.

COLORADO SPRINGS, CO -- Speedline Technologies executive Keith Favre has been named president and chief executive of PhotoStencil, Circuits Assembly has learned. Favre will assume his new duties next week.

TAIPEI – Delta Electronics Inc. announced its net revenues for July hit a record high of $11.1 million, a 27% increase year-over-year, and a 4% increase from June.

EL SEGUNDO, CA – Booming sales of digital televisions during the coming years will yield huge opportunities for semiconductor suppliers, with revenue from shipments of chips for this segment expected to double between 2006 to 2011, iSuppli Corp. predicts.

The global digital TV semiconductor market revenue will rise to $14.2 billion in 2011, expanding from $7.1 billion in 2006, says the research firm.

ROME, NY – The ESDA is requesting two-page abstracts for the International Electrostatic Discharge Workshop, taking place May 12-15 in Port D-Albret, France.

Presentations should address novel design concepts; special custom design approaches; technology integration issues; failure analysis; test structures; simulation tools; component-level ESD testing; ESD characterization; system-level ESD issues; immunity of ICs to EMI, and unresolved ESD issues.

Abstracts should be sent as PDFs to iew@esda.org no later than Nov. 26, and should include the title, author’s name and author’s affiliation.

The technical program committee will announce selections on or before Jan. 7.

YAVNE, ISRAEL – Orbotech Ltd., maker of circuit board inspection equipment, announced revenues for the second quarter totaled $88.6 million, up 2.8% compared to the first quarter, and down about 16% year-over-year.

Net loss for the quarter included a $4.8 million write-off of inventory, as well as a charge of $5 million relating to the company's write-off of its investment in Negevtech Ltd.

Revenues for the first six months of 2007 totaled $174.7 million, down about 15% year-over-year.

FRAMINGHAM, MA – Handset vendors shipped a total of 272.7 million units worldwide in the second quarter, about 6.9% more than the previous quarter, and 16.5% more year-over-year, according to researcher IDC.

Samsung beat Motorola for the number two spot in global market share, with 37.4 million units shipped, added the firm.

Following a slow first quarter, Motorola announced a dismal performance in handset shipments. On the other hand, Samsung announced its fourth straight quarter of record shipments.

Motorola was the only vendor to post a year-over-year decrease among the leading vendors, slipping to third place, citing ongoing shipment challenges in Asia, the Middle East, Africa, and to a lesser extent, Europe, said IDC. On the positive side, the company crossed a milestone having shipped its 100 millionth Razr phone.

Number one Nokia’s total shipments equaled more than those of the next three vendors combined (100.8 million units), said IDC. Much of Nokia's growth was attributed to its shipment growth within Europe and Asia, but still showed some signs of struggle in North America. At the same time, Nokia enjoyed a record shipment of 13.9 million units shipped in the region, thanks in part to its N-series and E-series devices.

Sony Ericsson remained the clear number four vendor, and took honors for having the largest year-over-year shipment increase among the leading vendors. Sony Ericsson's Walkman line of phones accounted for a third of its shipments, said IDC. The company also announced the W960 and W910, both expected to ship later this year.

In addition, Sony Ericsson announced plans to establish its own R & D site in Chennai, India, a move that will no doubt aid its manufacturing agreements with partners Flextronics and Foxconn, said the research firm.

LG Electronics, having reached a record shipment level, remained firmly in fifth place, and despite its improvements, closed the gap with Sony Ericsson only slightly, according to IDC.

DUSSELDORF, GERMANY – Henkel Corporation announced Production Automation Corporation will now distribute Henkel’s full line of Hysol, Loctite and Multicore brand electronics assembly and semiconductor packaging materials in North America.

PAC’s 15 outside sales representatives will sell Henkel’s line in New England, MN, ND, SD, NB, WI, TX, AZ, So. CA, and Mexico.

The agreement is effective immediately.