News
Jena, Germany – GÖPEL electronic will partner with PTS (Production Test Systems Ltd), headquarted in Shenzhen. PTS becomes the 11th Center of Expertise (COE) in GÖPEL’s electronic Alliance Partner Network (created to support JTAG/Boundary Scan applications).
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
Minneapolis, MN -- The SMTA International Technical Committee is asking for abstracts for the 2006 conference. Short course descriptions are also being solicited. The deadline for abstracts is Feb. 24, 2006; the SMTA International show is set for Sept. 24-28 in Rosemont, IL.
Sumit abstracts online here: smta.org/smtai/call_for_papers.cfm.
Paper are being solicited in emerging technologies, components, assembly, PCB technology, process control and business issues. Visit the Website for further specifics.
BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability.
In a statement, Karl Seelig, chair of the subcommittee that issued the report, stressed its findings on Pb- free voids. “Based on the comparison of the number and size of solder joint voids to thermal cycle interconnection failure date, there is no evidence that solder joint voiding has any significant impact on solder joint reliability."
San Francisco, CA - Design Chain Associates and EPTAC Corp. will continue its one-day seminar series, "Thriving in a RoHS/WEEE Environment," throughout the U.S. in 2006.
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
Bolton, MA -- DownStream Technologies opened its new corporate headquarters in Marlborough, MA. Located in region’s high-tech corridor along Rte. 495, the facility will house the company’s financial, marketing, sales and R&D operations.
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
PALO ALTO -- SiliconPipe received the Frost & Sullivan 2005 Excellence in Technology Award in the field of system-level interconnect solutions for its Novias technology. The technology is based on the removal of performance-limiting and expensive plated vias from the interconnection channel.
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The award is presented yearly to the company that has pioneered the development and introduction of an innovative technology into the market; a technology that has either impacted or has the potential to impact several market sectors.
AUSTIN, TX – 3M Electronics’ advanced laminate, 3M Embedded Capacitor Material, is RoHS compliant.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
Shropshire, UK – UK Manufacturers may get another six-month reprieve to implement the EU’s WEEE legislation, if a report from B2B Compliance proves true.
According to the report, the government is considering a proposal to delay the legislation until June 2006, with producer responsibility commencing in January 2007.
As yet, however, no further delays have been posted on the Department of Trade and Industry’s Website. Last August, the DTI announced that responsibility would not commence until June 2006, pushing back the deadline (originally, Aug. 15, 2005, then delayed to January 2006) due to insufficient preparations.
According to the report, the government is considering a proposal to delay the legislation until June 2006, with producer responsibility commencing in January 2007.
As yet, however, no further delays have been posted on the Department of Trade and Industry’s Website. Last August, the DTI announced that responsibility would not commence until June 2006, pushing back the deadline (originally, Aug. 15, 2005, then delayed to January 2006) due to insufficient preparations.
Munich – Markets for microsystems will double over the next five years from $12 billion in 2004 to $25 billion in 2009, a CAGR of 16%, according to a market report by NEXUS.
MST/MEMS sensors and actuators are predicted to continue to consolidate their position in established IT peripheral markets for read/write heads and inkjet heads, in addition to creating new opportunities for microphones, memories, micro energy sources and chip coolers.
The automotive sector remains a major application field with several high-volume safety products including air bags and tire pressure monitoring systems.
Helping propel the market is the meteoric rise of the consumer electronics segment, forecast to almost quadruple its share from 6% of the market in 2004 to 22% in 2009 (a CAGR of 50%).
“The growth of consumer electronics for MST is breathtaking,” said Dr Henning Wicht, managing director of WTC. “In this segment we see rear and front projection TVs for home theater, as well as HDDs serving the increasing storage requirements of digital equipment such as DVD recorders, digital cameras and camcorders, and portable MP3 players. A big driver is the mobile phone, which already features motion sensors and is amenable to a battery of additional sensors and functions like liquid lenses for camera zoom, fingerprint sensors, microfuel cell power sources, gas sensors and weather barometers.”
Of the 26 products analyzed in the report, 14 will have market volumes over $100 million, and completely new products such as microfuel cells, fingerprint sensors and liquid lenses will worth a combined $250 million in five years.
The study, NEXUS Market Analysis III, was coordinated by WTC (Wicht Technologie Consulting) on behalf of NEXUS (The Network of Excellence in Multifunctional Microsystems).
MST/MEMS sensors and actuators are predicted to continue to consolidate their position in established IT peripheral markets for read/write heads and inkjet heads, in addition to creating new opportunities for microphones, memories, micro energy sources and chip coolers.
The automotive sector remains a major application field with several high-volume safety products including air bags and tire pressure monitoring systems.
Helping propel the market is the meteoric rise of the consumer electronics segment, forecast to almost quadruple its share from 6% of the market in 2004 to 22% in 2009 (a CAGR of 50%).
“The growth of consumer electronics for MST is breathtaking,” said Dr Henning Wicht, managing director of WTC. “In this segment we see rear and front projection TVs for home theater, as well as HDDs serving the increasing storage requirements of digital equipment such as DVD recorders, digital cameras and camcorders, and portable MP3 players. A big driver is the mobile phone, which already features motion sensors and is amenable to a battery of additional sensors and functions like liquid lenses for camera zoom, fingerprint sensors, microfuel cell power sources, gas sensors and weather barometers.”
Of the 26 products analyzed in the report, 14 will have market volumes over $100 million, and completely new products such as microfuel cells, fingerprint sensors and liquid lenses will worth a combined $250 million in five years.
The study, NEXUS Market Analysis III, was coordinated by WTC (Wicht Technologie Consulting) on behalf of NEXUS (The Network of Excellence in Multifunctional Microsystems).
BANNOCKBURN, IL – IPC has released its 2004-2005 International Technology Roadmap for Electronic Connections. This version of the roadmap features more input from Asia and Europe than in previous years, and is split into two volumes.
The roadmap provides direction for product and process development for companies building electronic and optoelectronic equipment. Each chapter contains specific recommendations addressing current, near-term, mid-term and long-term requirements, proposed actions and opportunities.
SINGAPORE -- Solectron Corp. today opened a facility dedicated to manufacturing medical products such as high-performance liquid chromatographs and fluidics subassemblies.
The Singapore Medical Center of Excellence is sited in Chai Chee, Singapore's Techno Park, and employs staff who have worked at leading medical OEMs.
The Singapore Medical Center of Excellence is sited in Chai Chee, Singapore's Techno Park, and employs staff who have worked at leading medical OEMs.
GREENVILLE, SC -- Kemet Corp. today announced a definitive agreement to
purchase the tantalum capacitor business of Epcos AG for $101.9 million. The deal is expected to close next spring, subject to standard closing conditions and receipt of required
regulatory approvals.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri