BANNOCKBURN, IL – Total North American EMS shipments in July were down 2.9% year-over-year, says IPC. Sequentially, July shipments fell 26.3%.

SON, THE NETHERLANDS – Neways Electronics reported net revenue for the first half of 2021 was €233.8 million (US$275 million), down 3.8% year-over-year.

BANNOCKBURN, IL — North American printed circuit board fabricators reported the 90-day moving average PCB orders in July were up 18.6% year-over-year and down 4.3% sequentially.

NEEDHAM, MA – Worldwide shipments of PCs are expected to grow 14.2% to 347 million units in 2021, according to International Data Corp. This is down from IDC's May forecast of 18% growth, with continued supply chain and logistical challenges cited as the main reasons. The tablet market is also expected to grow in 2021 but at a slower pace of 3.4%.

NEW YORK – DarkPulse has signed a letter of intent to acquire EMS firm TJM Electronics West.

NORTHVALE, NJ – ADM Tronics reported fiscal first quarter revenues were $721,358 up 26% year-over-year. Net loss for June 30 was down 73% to $30,672 compared to June 30, 2020.

NEW DELHI – Wistron is partnering with Optiemus Electronics to make smartphones and laptops, according to reports.

TAIPEI – DRAM suppliers registered revenue for the second quarter reached $24.1 billion, up 26% sequentially, according to TrendForce. Heading into the third quarter, however, mismatched component availability issues began surfacing in the upstream supply chain and bottlenecking assembly of electronics devices.

MILPITAS, CA — North America-based semiconductor equipment manufacturers posted $3.86 billion in billings worldwide in July, up 49.8% year-over-year and 4.5% sequentially, according to SEMI.

ATLANTA, GA – Printed circuit engineers are ready to get back to face-to-face events, and the PCB West technical conference has all the reasons they need to make their return to live interaction more than worth their time. Registrants who sign up before September 7 can take advantage of the Early Bird Special discounts for the conference, which features 40 presentations spanning more than 120 hours of classroom time.

WASHINGTON – Face-to-face meetings have been scarce in the past year, but historically even rarer have been sessions between US electronics industry leaders and their counterparts in the US Department of Defense.

BERLIN – The second incarnation of a panel level packaging consortium, PLC 2.0, investigated warpage and die shift in large format reconfigured panels (18" x 24"), and considerable progress has been made toward understanding the root causes. With these insights, the relevant parameters can now be controlled better to enable large-area fine-line RDL processes. The analytical effort has paid off, as RDL could be scaled down considerably on the panel level, making the most of the advantages of both wafer and panel-level technologies and paving the way for an entirely new process chain with new equipment and materials.