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Written by Mike Buetow
HAVERHILL, MA -- A US-based research firm and a Japanese PWB fabricator have reportedly developed a solderable thick-film circuit system on a thin flexible substrate. The ability to solder the substrate enhances its potential for use as a basic technology in printable flexible electronics, the inventors say.
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Written by Mike Buetow
EL SEGUNDO, CA -- Global plasma panel shipments will increase 6.7% in 2009, compared to 19.7% growth in 2008, says iSuppli Corp., and some top makers are exiting the business.
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Written by Mike Buetow
LAS VEGAS -- CIRCUITS ASSEMBLY and Global SMT & Packaging will cohost a free series of technical presentations on electronics manufacturing during Apex at their combined booths.
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Written by Mike Buetow
EL SEGUNDO, CA – Once viewed as a promising emerging market with massive growth potential for the global electronics contract manufacturing business, Russia now is facing a cessation of new investment, along with shutdowns in existing facilities and delays in new ones, according to
iSuppli Corp.
BRUSSELS -- Beginning in August, the EU's REACH Candidate List of Substances of Very High Concern will be updated every six months.