Features Articles
One culprit could be package warping.
Figure 1 shows the Amkor TMV package after microsectioning the board assembly during failure analysis. This particular view shows open joints between the top package and the solder spheres on the bottom package.
Connectivity is embedded in the electronics ecosystem. And test should be embedded in the devices that support it.
The Internet of Things (IoT) is the new buzzword coined to describe the use of smart and connected electronic devices that enable greater efficiency and productivity in our daily lives.
Print and money: How the West’s inflexibility costs us all.
Some things our industry does are simply extraordinary!
The technology we’ve imagined, created, developed and harnessed has been nothing less than awe-inspiring.
For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.
Diverting bad boards from the field is often in the eye of the beholder.
Contrary to what you may think and, most unfortunately, Figure 1 is not a Goodyear Blimp-eyed view of a Hershey’s Chocolate Kiss or an Arabica coffee bean. Pity. Desire rudely thwarted, I was getting hungry.
An early focus can cut product development time and reduce process variation.
Design for manufacturability is a cornerstone in any Lean manufacturing strategy because it supports Lean philosophy in several ways.
Press Releases
- Surf-Tech Manufacturing Is Proudly Made in the USA, Delivering Quality Amid Tariff Changes; Stephen Eggart Comments
- AIM Solder and India’s Persang Alloy Industries Announce Strategic Joint Venture; David Suraski Comments
- Federal Electronics Continues Tradition of Giving Back Through McAuley Ministries’ Lunch on Us Program; Ed Evangelista Comments
- Kodiak Assembly Solutions Welcomes Jaden Troutman to Its Business Development Team; Michael Harlow Comments