Products
SolderKing released SAC0307, a low-silver alloy option within its SK P2-5 solder paste family designed to support flexible alloy selection while maintaining the same established flux chemistry and process settings. The paste enables manufacturers to evaluate alternative alloy compositions without modifying existing production parameters. Designed for surface-mount assembly applications requiring reliable stencil printing and consistent wetting across common PCB finishes including OSP, ENIG, immersion silver, tin and HASL. The flux formulation is designed to reduce voiding and head-in-pillow defects while leaving minimal residue after reflow. The material complies with J-STD-004B and Bellcore ECM requirements. Available in Type 4 (20–38µm) and Type 5 (15–25µm) powder grades to support fine-pitch and high-density assemblies. Extended tack and open times exceeding three days provide flexibility for longer production runs or staged builds, while a 12-month refrigerated shelf life supports material inventory management.
SolderKing Assembly Materials
OE in a Box packages the key materials required to generate IPC J-STD-001 objective evidence reports for electronics manufacturing reliability validation. Kit includes B-52 Legacy 2 test cards, taped components, a stencil offering from Metal Etch Services, ESD bags and other materials needed to perform surface insulation resistance (SIR) testing preparation. Simplifies the process by shipping all required items in a single kit with return logistics so manufacturers can quickly send completed boards to Magnalytix for third-party testing and validation reports. Platform is designed to accelerate reliability verification, support compliance documentation and streamline testing workflows.
TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.
630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.
Electrovert EcoWave wave soldering option designed to enhance solder performance, reduce dross formation and extend maintenance intervals in electronics assembly operations. Patented single-wave nozzle integrates DwellFlex 4.0 adjustable contact length and Auto Exit Wing defect-mitigation technologies to improve wave stability and process consistency. Nitrogen-directed wave-forming design minimizes oxidation, with reported dross reductions exceeding 50% and reaching up to 75% in some applications. System maintains solder above liquidus throughout the contact sequence to improve plated-through-hole fill and joint integrity without increasing nitrogen consumption. Design reduces mechanical complexity and dross accumulation, with manufacturers reporting maintenance interval extensions of up to 93%.
Vitronics Soltec ProcessGuard option designed for inline thermal monitoring and analytics within reflow soldering processes. System provides real-time visibility into heating and cooling zone performance to reduce routine profiling and support early defect detection. Compatible with third-party data loggers for baseline profile validation. Integrated directly into machine software with MES connectivity for traceability and smart factory integration. Includes redundant thermocouples in heating and cooling zones, quick-connect thermocouples for maintenance, and embedded ProcessGuard analytics interface. Field-upgradeable for Vitronics Soltec Centurion reflow ovens.
