Hirose launched the IT18 Series COM-HPC compatible BGA mezzanine connector supporting PCIe Gen5 (32GT/s), PCIe Gen6 (64GT/s PAM4) and 100Gb Ethernet (4×25Gb) transmission for high-density embedded and industrial applications. Connector features 400 positions on a 0.635mm pitch in a low-profile design with 5mm and 10mm stacking heights. Open pin field grid array design enables flexible routing of signals, grounds, and power for signal integrity optimization and varying layout requirements. Connector incorporates crosstalk suppression technology, including far-end crosstalk cancellation and utilizes a metal cap structure to reduce warpage and protect contacts during reflow. Additional features include retention tabs to reduce solder ball cracking risk, pin-in-ball soldering structure, and alignment guides for mating reliability. Designed for industrial automation, medical imaging, and test and measurement equipment applications.

Incap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory. The approximately EUR 1.53 million investments increase the factory’s production capacity and improve operational efficiency. The investments support growing customer demand for testing smaller and more complex products and enable Incap India to scale production efficiently for both existing and new customers.

Murthy Munipalli, Managing Director of Incap India, described the upgrades as a key part of Incap’s strategy to improve throughput and expand manufacturing capabilities. “We made these investments to reduce changeover time, improve test coverage, and get new projects up and running faster. This will help us stay efficient and reliable as volumes grow, while strengthening existing relationships and supporting long-term partnerships,” Munipalli said.

The new flying probe system enables fixtureless, double-sided testing for both prototypes and production volumes. This type of testing is increasingly requested by customers as electronic products become smaller and more complex. The system reduces test time by 50% compared to older systems and includes features such as 3D height measurement, LED and JTAG testing, and thermal scan capabilities. According to Munipalli, it is easy to program and supports fast setup, while the machinery is designed to handle both large and densely populated, complex boards. Together, these capabilities improve fault detection and speed up new product introduction.

The new SMT line reduces changeover time by up to 25%, increases production speed, and lowers maintenance costs by replacing older systems. Munipalli describes that the new line significantly reduces downtime, improves reliability, and is better suited to the requirements of new customers and higher production volumes. Together, the investments strengthen test coverage, boost flexibility, and support consistent quality as production volumes grow. They also help reduce lead times and improve responsiveness to customer needs.

With both upgraded systems now fully operational, Incap India is well positioned to support continued growth and strengthen its long-term competitiveness.

Incap India factory is located in Tumkur, near Bangalore. The three factories at Incap India have a total floor space of 34,561 square meters and produce inverters and UPS systems, battery chargers, PCBs for fuel and cash dispensers, power supply units, rescue devices, solar inverters, drives and medical devices as well as other electronic industrial products. The machinery is suitable for common component technologies, and together with the strategic location and skilled personnel, Incap can provide high-quality manufacturing services to meet the most demanding customer needs.

Medical-grade adhesive portfolio adds five IBOA- and TPO-free formulations for electronics applications, including Photobond MG4202, MG4191, MG4094, MG4186 and MG4164. The adhesives are adapted from semiconductor and consumer electronics technologies and designed for structural bonding, sealing and multi-purpose use in medical devices. Fast-curing formulations support LED curing in one second at 400nm and operate across a temperature range of -40°C to 125°C. Variants include fluorescence for process control, peel resistance for durability, and sealing capabilities for FIPG and CIPG applications. 

Stackpole Electronics has released the RVCA Series automotive-grade thick-film high voltage chip resistors. Designed for high-voltage applications requiring compact form factors and extended resistance ranges. Anti-sulfur compliant per EIA-977 and validated through load life, biased humidity, short-time overload and temperature cycling testing to support use in harsh automotive and industrial environments. Supports resistance values from 30kΩ to 100MΩ and voltage ratings up to 3kV in the 2512 case size, with 0805 and larger packages rated at 400V minimum.